Used SEZ / LAM RESEARCH Chambers for SP 323 #293653786 for sale

ID: 293653786
Wafer Size: 12"
12".
SEZ / LAM RESEARCH Chambers for SP 323 is an advanced etching/ashing equipment designed for semiconductor engineering applications. It is capable of enhanced surface etching and precise chemical ashing of a wide range of materials, including various metals and glass. The system's set of reactive gas mixers and valves enable quick and accurate delivery of plasma processing atmospheres. Its automatic process control software enables the entire unit to be operated from the user's own PC computer. SEZ Chambers for SP 323 consists of three basic elements - a stainless steel vacuum chamber, a robotic sample handling machine and a dedicated plasma source. The vacuum chamber, which is located in the bottom of the tool, is designed to handle wafers with a variety of sizes (up to 8-inch circles or square). It is constructed with an ellipsoidal process chamber, a robot arm, a heater and an electrostatic shield. The robot arm enables fast, precise and repeatable sample loading and positioning within the asset. The heater is used to maintain uniform temperatures across all the surfaces of the model. The electrostatic shield is designed to reduce the particles generated in the etching/ashing process. The dedicated plasma source of SEZ Chambers enhances the surface etch process and offers precise chemical ashing of a wide range of materials. It utilizes an asynchronous, pulsed-RF generator to produce an intense radio-frequency (RF) field between two electrodes. This RF field can be controlled with a frequency ranging from 7.5MHz to 13MHz or the deposition frequency can be adjusted manually to the substrate's specific requirement. Also, the frequency can be aligned according to the process chamber pressure to ensure optimal process results. The set of reactive gas mixers and valves enable fast generation and delivery of the exact plasma processing atmospheres required by the etch/ash process. The equipment can be equipped with a wide variety of gases such as oxygen, nitrogen, Argon, Helium, F2, NF3, SF6 and CF4, with a wide range of delivery ratios for various processing tasks. The system also has an effective emergency purging unit to ensure the safety of users and their samples. Finally, LAM RESEARCH Chambers for SP 323 has an intuitive, graphically based automatic process control software. It is used to define and run all aspects of the etching/ashing process, from setting up recipes to controlling the runtime of each process step. This control machine provides reliable process safety and repeatability for each process step. In conclusion, Chambers for SP 323 offers superior etching/ashing capabilities, is fully automated and provides reliable process safety and repeatability. With its advanced features and capabilities, it is an ideal tool for semiconductor engineering applications.
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