Used SEZ / LAM RESEARCH DV-34 #9233096 for sale
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ID: 9233096
Wafer Size: 12"
Vintage: 2007
Single wafer processing system
Particle, polymer, & residue removal
Wafers
Wafer type: Standard
Wafer surface treatment
Cassette interfaces
(25) Wafers
Wafer robot (dual arm): BROOKS DBM-2406 V
Robot controller: BROOKS EDC-2400
Dual ceramic end effector
End effector size: 12
Options:
OHT (Over Head Transfer)
Light curtain
Ionizer: 5285e / 4630
No open cassette adapter
No wafer protrusion sensor (200mm)
No carrier ID reader (RFID)
No AGV
Process modules: 4 / 8 Chambers (L / R) 4 chambers
PSL-1 & PSL-2 (Left side):
Medium-1 arm (Standard): Chemical used
Medium-2 arm (Option): Chemical used
DIW Arm
Chuck (ADV pin)
Spindle & elevating units
PM I/O & Safety Box
No active jet nozzle
PSR-1 & PSR-2 (Right side):
Medium-1 arm (Standard): Chemical used
Medium-2 arm (Option): Chemical used
DIW Arm
Chuck (ADV pin)
Spindle & elevating units
PM I/O & Safety box
No active jet nozzle
Liquid / Chem supply cabinets (CHC1 / CHC2):
CHC1: (Standard & Dual tank)
Tank A:
Medium REZI38 Mix ratio / Temperature 25°C
Medium fill port, type: Auto fill
Medium paddle wheel
DIW Fill port, type: Auto fill
DIW Paddle wheel
Medium in-line filtration system
Sampling port
Buffer tank
Suckback valves
ULTRASONIC Flow meter
Tank B:
Used for chemical
Medium REZI38 Mix ratio / Temperature 25°C
Medium fill port, type: Auto fill
Medium paddle wheel
DIW Fill port, type: Auto fill
DIW Paddle wheel
Medium in-line filtration system
Sampling port
Buffer tank
Suckback valves
ULTRASONIC Flow meter
Dual in-line heater & cooler
No DI/O3 line
Process pump
No booster pump
Recirculation pump
Drain pump
CHC2:
System standard: (8) Chambers
System option: (4) Chambers
Tank A:
Medium paddle wheel
DIW Paddle wheel
No medium in-line filtration system
Sampling port
No buffer tank
Suckback valves
ULTRASONIC Flow meter
Tank B:
Medium paddle wheel
DIW paddle wheel
No medium in-line filtration system
Sampling port
No buffer tank
Suckback valves
ULTRASONIC Flow-meter
Dual in-line heater & cooler
No DI/O3 line
Process pump
No booster pump installed
Recirculation pump
Drain pump
CDS I/O & safety box
Separate drain
Chemical supply:
Med-1 Pre mix
Med-2 Pre mix
DIW
Option: HORIBA Chemical analyzer
Safety:
Earthquake protection
FM 4910 Compliant material
No main unit drip pan
No drip pan leak detection
Host control:
SECS II (HSMS)
No SECS II (RS232)
User interface:
Status lamp (R/Y/B/G)
Sound module
Front & back side UI (touch+keyboard)
Options:
Wafer handling robot display (CCD / Monitor)
Process chamber display
No dedicated backing pump
No XRD module
No ozone module
Transformer: 30 kVA
Transformer CE compliant (Input 208 Y)
No transformer CE compliant with GFI (Input 208 Y)
UPS
No entire system (30 kVA): In 400 VAC / Out 400 VAC
No control PC only (2 kVA): In 230 VAC / Out 230 VAC
No pre-etch thickness
No post-etch thickness
No target uniformity of etch
No backside surface conditioning
No rough finish
No polished finish
No front-side etch
No back-side etch
No backside etch & bevel clean
No oxide thinning / Removal
No nitride thinning / Removal
No polysilicon thinning / Removal
No bevel clean
No undercut
Missing parts:
(2) ECO Tune motors
(8) Dispenser motors
(2) Brake pin cylinders
(2) Dispenser nozzles
(2) VALVlE SAM-3250-NZD401FFI(12)
Drain pump
Filter
Power supply: 208 VAC, 20 kVA
Power Distribution Box (PDB)
CE Color code
No UL color code
2007 vintage.
SEZ / LAM RESEARCH DV-34 is a high performance etcher/asher that offers the most efficient and reliable substrate processing available. With its advanced features and superior accuracy, this tool is ideal for many different applications, from sputtering and anodizing to resist removal and lithography. The etcher/asher gas delivery equipment is designed to maximize throughput while minimizing substrate damage. It also provides precise control over gas flow and process parameters to deliver consistent results. The etcher/asher's rotational baseplate allows for rapid spin-and-go processing of all substrates up to 8 inches in size. It features a universal drive system with adjustable pressure and flow to accommodate different substrates and processes. Additionally, its gas delivery unit is adjustable to match the process parameters needed, allowing for precise control during etching and ashing. It is also equipped with chamber protection when scaling up or down, making sure that the equipment and the substrates remain in top condition. On the software side, SEZ DV-34 etcher/asher has a flexible control machine for advanced process optimization and monitoring. It offers real-time feedback on gas flow and chamber conditions, as well as alarm notification, automatic time-out, and remote control functions. The user interface is highly intuitive and easy to use, providing simple programming and process control. This makes LAM RESEARCH DV-34 a reliable and versatile tool for many different applications. High uniformity, repeatability, and reliability make DV-34 etcher/asher a great choice for semiconductor research and production. It is capable of performing wet etching, dry etching, and ashing processes with up to 200 micron accuracy. Its low power consumption and tool-level diagnostics make it an attractive choice for high-throughput production environments, while its flexibility and ease of use also make it a great choice for advanced research.
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