Used SEZ / LAM RESEARCH DV PRIME #293754189 for sale

SEZ / LAM RESEARCH DV PRIME
ID: 293754189
Wafer Size: 12"
Vintage: 2011
Etcher, 12" (8) Chambers 2011 vintage.
SEZ / LAM RESEARCH DV PRIME is a state-of-the-art etcher/asher equipment designed to provide superior process capabilities for high aspect ratio processing applications. It is ideal for advanced technology nodes, such as 3D IC, MEMS, advanced logic, and mixed-mode applications. The machine is equipped with a large, 4" thermal chamber design, providing greater volumetric throughput capabilities and reduced cycle time. The high degree of accuracy is maintained through optical and other process control feedback devices placed throughout the chamber, enabling precise control over process parameters. It also features a variety of process modes to accommodate a range of etching and ashing applications, including high-density isotropic etching, high selectivity etching, and multi-level etching. The system is further equipped with two independent, high-end modulators - the multi-field modulation capability of SEZ/LAM SEZ DV PRIME enables higher levels of feature-level accuracy in etching and ashing processes than traditional single-field modulators. Additionally, unique features such as advanced fuzzy logic PID control, in-situ angle control, and reactive etch enable a greater degree of process control and accuracy. In addition to the advanced etching and ashing capabilities, LAM RESEARCH/LAM LAM RESEARCH DV PRIME's flexibility in configuring processes allows for higher levels of optimizing recipes to achieve desired results. Furthermore, its in-situ RF matching module helps ensure a successful match on each cycle and facilitates quick and easy recipe customization and fine-tuning. Overall, SEZ / LAM RESEARCH/LAM DV PRIME is an advanced, multi-function etcher/asher unit designed for high aspect ratio etching and ashing applications. Its unique combination of processing capabilities, process control, and flexibility makes it an ideal machine for a range of advanced applications, such as 3D IC, MEMS, advanced logic, and mixed-mode technologies.
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