Used SEZ / LAM RESEARCH RST 201 #293600300 for sale
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ID: 293600300
Spin etcher
(4) Vertical ring chambers
Single wafer process for front and back side
Dispenser system
CDS System
DIW Arm
N2 Arm
Load system: (2) Open cassettes, 8"
Single arm robot with AL vacuum end effector
(2) ECO Swivel levers: Front / Back side wafer handling
Standard chuck, 8"
Vacuum end effector
LAUDA Heater exchanger
Temperature: 65°C
Power: 2.3 kW
Dry N2 monitor
Suck back system
Chemical drain tank
PVDF Tube / Tank material
PD Box
Speed motor
CDS With PC
Front side control table
PC and motor controller
Cables
Offline monitor
Heat exchanger temperature:
Warm / Fault: 65 ±2°C
Warm / Fault: 65 ±3°C
Medium X Flow:
Medium 3 Flow (SLM/MN): (HF: CH3COOH 505 LPM)
Safety:
EMO Type: Turn to release
Label: Emergency off
EMO Button guard ring
Water leak detector
DI Rinse flow: DIW (SLM/MN)
N2 Dry flow: (SLM/MN)
Chuck N2 Flow (SLM/MN): 275 ±25
Chuck spin speed (RPM):
During process step: 1000 ±100
Clean process step DI: 1000 ±100
Clean process step N2: 2000 ±100
Chuck pin, P/N: 2006830
ECO Pin, P/N: 2010343
ECO Motor, P/N: 2006775
Pump:
Return: Nippon pillar (Bellow pump)
Supply: Nippon pillar (Bellow pump with accumulator)
Suck back valve:
Filter
Chuck motor hauser
63A Line amperage
400 LPM Glass flow MFM Flow warm / Fault
Frequency: 50 Hz
Does not include:
Wafer defect system: Glass
Chemical filter
Touch screen monitor
Power supply: 200-208 V, 4 W, 3 Phase.
SEZ / LAM RESEARCH RST 201 is an etcher/asher equipment designed to meet the demanding requirements of modern manufacturing processes. It is designed to provide superior process control and quality assurance in a variety of semiconductor applications. The system features rapid thermal processing (RTP) technology to quickly and accurately etch/as or plate various materials. Its fully computerized control unit and precision motion controls allow for quick and easy setup, while also providing consistent and reliable results. The machine also features a light load lock chamber, ensuring optimal sample protection and repeatability. SEZ RST 201 is capable of high-precision etching and ashing in both wet and dry formats. Its unique physical design and RTP technology deliver the highest possible accuracy and the fastest processing times. Additionally, the tool's versatile processing chamber allows for a variety of sample sizes and shapes without compromising the process accuracy. LAM RESEARCH RST 201 is also engineered for maximum efficiency, utilizing LAM's proprietary process recipes for optimal performance. RST 201 is designed with a range of safety features to protect users from any hazardous conditions and to maximize safety in the workspace. The chamber features an integrated safety interlock to ensure the safety of workers, and the asset is designed with automated safety systems that monitor chamber conditions and take action to restrain any unsafe conditions. Additionally, the model is constructed with corrosion-resistant materials and is designed to withstand high temperature and contaminants. SEZ / LAM RESEARCH RST 201 comes with a range of advanced process monitoring and data recording capabilities. A dedicated computer and software package allow operators to monitor the process in real-time and remotely control the equipment. Additionally, it includes automatic recipe control and process logging for comprehensive traceability. This helps to ensure repeatability and consistent performance. Overall, SEZ RST 201 is an exceptionally reliable and accurate etcher/asher system that is ideal for a variety of semiconductor applications. It offers rapid and precise etching, plating and ashing processes, and is designed with a range of features to ensure safety and repeatability. Its high-quality construction and state-of-the-art programming are built to withstand years of use, providing long-term performance, productivity, and cost savings.
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