Used SEZ / LAM RESEARCH SP 323 #9211042 for sale

SEZ / LAM RESEARCH SP 323
ID: 9211042
Etchers.
SEZ / LAM RESEARCH SP 323 is an etcher/asher designed for dry etching and ashing silicon, copper, glass, and other materials. It features a quartz-coated, large-area chamber, heated up to 2450°C for high-density plasma etching. It operates under high-density plasma (HDP) and has an impressive deposition rate of up to 10A/min. SEZ SP 323 offers a range of chambers to choose from, depending on the size of the object and the type of etching/ashing that needs to be done. With a vacuum range of 10-5 torr to 10-4 torr and a power output of up to 40kW (when pumped to an RF frequency around 13.56 MHz, it's ideal for complex etching jobs. To prevent damage to delicate surfaces, the chamber also supplies an electron flood gun and nitrogen back-cooled walls to ensure there is no chemical contamination. LAM RESEARCH SP323 is made up of two chambers: a vacuum chamber and an RF generator. The vacuum chamber is sealed shut to ensure uniform processing conditions. The chamber is made of quartz, which offers longer service life and better processing accuracy for critical applications. The RF generator sends radio frequency waves into the chamber, enabling precise control of process parameters. SEZ / LAM RESEARCH SP323 is equipped with a variety of diagnostic tools such as quad And digital RF spectroscopy systems, Faraday probe, mass spectrometry system, and computer-aided plasma diagnostics. These systems allow for precise measurements of characteristics like the electron temperature, ion temperature, plasma species and density, as well as reactant/product ratios. This helps the user determine the best processing conditions for the task at hand. Overall, SP 323 is a high-performance etcher/asher designed to handle even the most demanding dry etching and ashing jobs. With its large-area quartz chamber, nitrogen-cooled walls and RF generator, the machine provides an optimal environment for etching and ashing silicon, copper, glass and other materials. Additionally, its high deposition rate makes it suitable for high-volume production environments.
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