Used SHIBAURA RPA 300 #182686 for sale

SHIBAURA RPA 300 is a fully automated etcher/asher designed for high-precision, high-throughput chip production. Its features include advanced features such as an integrated wafer loader, an interactive graphical user interface, and a large number of process configurations. RPA 300 utilizes a newly developed Scanning Ion Beam Sharpening equipment that creates fine, photolike patterns in a very short time compared to traditional etching processes. In addition, a passivation film technology ensures that die sides are protected from corrosion and temperature stress. SHIBAURA RPA 300 also includes an advanced wafer loader. This allows up to 24 wafers to be loaded automatically into the vacuum chamber and maintains the precision alignment of the wafers during the etching process. The interactive graphical user interface of RPA 300 allows for easy programming of the etching parameters and process times. A wide variety of process configurations are available, which can be chosen from the multiple pre-defined processes to meet customer requirements. SHIBAURA RPA 300 is designed for maximum process precision. It has an accuracy of ±4µm for die development, ±3µm for mirror alignment, and ±2µm for etching depth. Additionally, a semi-closed source system is adopted to improve contamination prevention. In terms of loading and unloading material, RPA 300 has a unique cassette loading unit which enables up to 12 cassettes to be loaded into the machine at once. This results in a higher throughput and shorter loading and unloading time. In summary, SHIBAURA RPA 300 is a versatile, high-precision etcher/asher designed to make life easier for the chip production industry. It offers a wide variety of process configurations, an advanced wafer loader, an interactive graphical user interface, and a large number of process configurations. Its built-in Scanning Ion Beam Sharpening tool creates photolike patterns in a short amount of time while protecting the die sides from corrosion and temperature stress. It is an ideal choice for high-throughput chip production.