Used SOLAR SEMI ENGINEERING E6710 #293649341 for sale

ID: 293649341
Porous silicon etching system Full-area porous Si layer formation Single wafer processing with fast cycle time (10 wafers per hour) Wafer: Round, 6" / Square, 5" Internal circulation of etchant Upper controls panels Laminar air flow wafer processing area Wet plenum area Sample station Fan and HEPA filter housing.
SOLAR SEMI ENGINEERING E6710 is a powerful etching/ashing process which enables accurate and repeatable surface processing. This machine is an advanced version of the standard etching/ashing process, which is a standard method for applying a protective coating to a range of surfaces including metals, plastics, polymers and composites. This advanced etching/ashing process is designed for applications which require precision surfaces which need to be dry etched and ashed with exceptional consistency. E6710 features various adjustable parameters that can be used to create a wide range of process recipes specific to the material being processed. The machine's control system allows users to customize the process parameters to achieve the desired surface finish and chemical composition. The control system also includes a set of safety features which can shut down the machine if an abnormal process change occurs. SOLAR SEMI ENGINEERING E6710 utilizes high-intensity ultraviolet (UV) radiation which is focused onto the material being processed. This intense UV light exposure greatly accelerates the photo-chemical reaction, causing chemical bonds to break and subsequently be removed from the surface. The chemical compounds which are removed by the etch/ash process are typically sulfur compounds or hydrocarbon compounds, which are often present on the surface of various materials. Additionally, the intense UV light can be used to modify the surface chemistry, such as creating hydrophobic (repels water) and hydrophilic (attracts water) surfaces. E6710 has an effective process range of about 0.1-400 mm, with process compatibility with a wide range of materials up to 10mm in thickness. Additionally, the machine is equipped with a nozzle system which allows for precise control of the plasma stream and its direction. This allows for more precise and consistent etching/ashing operations. The machine also uses an enclosed plasma chamber which helps to protect operators from exposure to harmful UVC rays. This chamber also helps to contain the UV light emitted by the machine. SOLAR SEMI ENGINEERING E6710 is an excellent choice for those in search of a powerful etching/ashing platform. This machine offers precise and repeatable surface processing that can result in a wide variety of surface finishes. Furthermore, its safety features and enclosed plasma chamber make it an ideal choice for users looking for a reliable and safe etching/ashing machine.
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