Used SPTS APM-011 #293807975 for sale

Etcher Size: 150 mm / 200 mm ICP Chamber Etching rate: Si >10 µm / min Etching ratio (AR): >30:1 AR Capability: 4.8 µm / 0.64 µm Process: TSV MEMS Wide hole pattern: Depth: 497 µm Etching rate: 5.0 µm / min Mask selectivity: 64 Sidewall angle: 89.7° Wide trench pattern: Depth: 501 µm Etching rate: 9.0 µm / min Mask selectivity: 138 sidewall angle: 90.0° 4.8 µm Wide trench pattern with aspect ratio: 51 Depth: 245 µm Etching rate: 2.7 µm / min SiO2 Mask selectivity: 52 Sidewall angle: 90.1° 0.64 µm Wide trench pattern with aspect ratio: 93 Depth: 59.4 µm Etching rate: 0.7 µm / min Ai Mask selectivity: 380 Sidewall angle: 89.9° 2016 vintage.