Used SPTS Delta FxP #293800451 for sale

SPTS Delta FxP is an advanced plasma etcher/asher used in the semiconductor industry for precise and high-performance etching and ashing processes. This versatile tool is designed to meet the demanding requirements of advanced semiconductor manufacturing, offering a range of process capabilities for microelectronics, MEMS, and other emerging technologies. Delta FxP features a dual-frequency power source with both RF (radio frequency) and MW (microwave) capabilities, allowing for enhanced process control and flexibility. This dual-frequency power capability enables the equipment to achieve a wider range of process conditions, resulting in better etch and ash uniformity across a variety of substrate materials and sizes. One of the key features of SPTS Delta FxP is its advanced process chamber design, which is optimized for high-throughput and low particulate generation. The chamber is equipped with a combination of gas injection systems, RF biasing, and temperature control to ensure precise control over the etching and ashing processes. This design allows for consistent process repeatability and performance, essential for high-volume semiconductor manufacturing. Delta FxP also features a sophisticated gas delivery system that enables precise control over gas flow rates and mixtures. This unit is critical for achieving the desired process chemistry and performance, as different gases and gas mixtures are used to etch or ash specific materials with high selectivity and uniformity. The machine is equipped with advanced endpoint detection capabilities, allowing for real-time monitoring of the etching and ashing processes. This enables the tool to precisely control the process endpoint, ensuring the desired amount of material is removed without over-etching or damaging the underlying layers. The endpoint detection asset helps to improve process control and repeatability, leading to higher yield and device performance. SPTS Delta FxP is also equipped with a high-performance substrate handling model that can accommodate wafers of various sizes and thicknesses. The equipment can handle both standard and highly sensitive substrates, providing the flexibility needed for different process applications. The substrate handling system is designed to minimize particulate generation and ensure proper substrate alignment and contact during the etching and ashing processes. Overall, Delta FxP is a state-of-the-art plasma etcher/asher unit that offers advanced capabilities for semiconductor manufacturing. Its dual-frequency power source, advanced process chamber design, precise gas delivery machine, endpoint detection capabilities, and substrate handling tool make it an ideal tool for high-volume production and research environments. With its superior process control and performance, SPTS Delta FxP is a valuable asset for companies looking to achieve advanced semiconductor device fabrication with high precision and reliability.