Used SPTS MPX DSIE / XeF2 #9186565 for sale

SPTS MPX DSIE / XeF2 is an etch and asher equipment designed for the production of high quality micron and submicron structures. It uses proven techniques to etch away material such as hard metals, semiconductors, polymers, and thin-film stacks quickly and accurately. This etch and asher system consists of a speed-controlled, servo-driven sputtering source with integrated dry etching and ashing sources, as well as SCi-MEMS integrated load-lock robotic handling. This unit is developed to provide maximum process control with uniformity, repeatability, throughput, and process performance. The DSIE XeF2 is specifically developed for applications such as dry etching and ashing that require high aspect ratio, ultra-high aspect ratio re-entry, and metal patterning. Such applications include advanced memory devices, chip-level 3D structures, high-voltage devices, and advanced packaging. The primary benefit of this machine comes with its ability to precisely control both the etching and ashing processes, regardless of range of materials complexity, wafer size, and geometry. The DSIE XeF2 is equipped with advanced features such as multi-station processing, advanced source shutter control, independent RF and DC bias tuning, and comprehensive end-point monitoring capabilities. This etch and asher tool offers a high level of sensitivity and accuracy, with low total cost of ownership. Furthermore, its integrated load-lock robotic handling enables fast wafer exchange and decreases the time taken to process a single wafer. The DSIE XeF2 asset also provides a high degree of process control, allowing users to easily and precisely control process parameters such as chamber pressure, RF power, gas flow, bias power, etc. Such fine-grained process control, in addition to the model's robust computerized control and monitoring capabilities, helps ensure repeatability and repeatable process performance. MPX DSIE / XeF2 etch and asher equipment offers a wide range of performance advantages and cost-pleasing benefits for the production of high-quality micron and submicron structures. Its versatile platform enables a variety of process capabilities and capabilities, and its cost-effective operation enables higher yields and profits, while also providing high-precision etching and ashing of materials at an affordable cost.