Used SPTS Omega FXP #9186561 for sale
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ID: 9186561
Wafer Size: 8"
Vintage: 2012
Rapier plasma etch system, 8"
(3) Electronics control cabinets
(4) Main system chillers
(5) Upgrade kits, 8"
(2) DSI Rapier process module
Wafer transport module: fxP
Multi chamber system
Standard system features:
(4) Color alarm towers
Bracket-mounted high resolution color
TFT Monitor with keyboard
Thru wall panel
PC104 Control architecture
Devicenet control module:
Pendulum valve
MFCs
Pneumatics
Fore-line convectron
Thermocouples
Electronics rack
Cable: 10 m
Electronics cabinet
CE Compliant
SEMI -S2 Compliant
(2) System manuals on CD
Conversion kit, 8"
Rear control station
fxP Transport module:
(8) Port wafer transport modules
Brooks MagnaTran 7 series robot
(2) Fixed vacuum cassettes
Dynamic wafer aligner
DSi Rapier process module:
Bosch process deep Si module
Rapier plasma source
Module envelope contains
Process control hardware
Control unit PC104
AE Apex RF generator:
Primary source
Secondary source
Bias - HF
Bias - LF
RF Bias match
Top power fixed match
DC Coil supply
Heated VAT pendulum valve
Electro-static chuck
PSU / He back-pressure control
Heated lower chamber
DSi Upper chamber / Foreline
Extracted surface mount gas boxes:
Primary
Secondary
ALCATEL ATH2300MT turbo pump
Automated He flow endpoint
Turbo by-pass for module roughing
Chamber capacitance manometer (1.0 torr)
Foreline mini-capacitance manometer
Wafer edge protection ring
Perfluoroelastomer seals
Options:
Claritas optical endpoint system
Ancillary equipment:
Re-circulating chiller (Bettatech CU700)
Chills platen
ADIXEN ADP122LM
ADIXEN ADS602H
THERMO Flex 24000 NESLAB chiller
Chills pumps
Includes:
Main chamber
Handler
Control cabinet
Computer holder
(2) Pumps
Spare parts
2012 vintage.
SPTS Omega FXP is an etcher or asher designed for high volume production and reliability. The equipment features a number of unique characteristics that enable it to handle multiple process steps simultaneously and accurately. The system is based on SPTS Technologies patented 350 mm wafer load lock exchange mechanism, enabling up to three process steps in parallel for rapid throughput. The chamber design and engineering ensure a reliable process with minimal down-time and minimal human intervention. The unit can be equipped with a range of options such as chemical delivery systems, high RIOs, shielding plating, and additional configurations for custom applications. SPTS OMEGA FXP makes use of high resolution lap distance control and closed-loop endpoint monitoring to ensure accurate and repeatable processing. It is equipped with a variety of gas supply and control options to support etch chemistries and etch processes that require precise gas control. The machine also features a proprietary process jet monitor, which provides real-time data on pressure, temperature, and etch rate. This data ensures that the process parameters are within desired ranges and can be used to adjust recipes and ensure consistent and repeatable process results. The tool's integrated Hardware Test and Evaluation (HTE) software allows for efficient automated testing of repeatable process parameters prior to production. The asset is connected to a secure network to monitor performance and ensure operational integrity. The data can be shared with other systems for real-time process control and recipe adjustments. To enhance process performance and quality, Omega FXP can be integrated with a variety of automatic loading and handling systems. These systems provide automatic wafer loading, unloading, and transfer, improving yield and throughput. The model also comes with an array of advanced automatic equipment control features for enhanced process control, alarm management, and recipe execution. Overall, OMEGA FXP is an advanced etcher/asher designed to meet the needs of today's high-volume production requirements with a focus on reliable and repeatable processes. With its advanced wafer loadlock exchange mechanism, fault-tolerant design, and multiple process configurations, SPTS Omega FXP is a great choice for a wide variety of etch processes.
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