Used SPTS Sigma FxP #9058880 for sale
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ID: 9058880
Wafer Size: 6"
PVD System, 6"
Aluminum, Ti, TiN deposition
8-Port Transport Module configured as follows:
• 150 mm wafer size
• Two Vacuum Cassette Elevators (VCE)
• Transfer Chamber with high throughput Magnatran 7B Robot
• Inligner for wafer pre-alignment
• Cooldown Station for post-process wafer cooling
• Pfeiffer TPH260 turbo pump for each VCE
• CTI Onboard 8 Cryo Pump for Transfer Chamber
Hot Soft etch (HSE) module (1):
Inductively Coupled Plasma (ICP) module for wafer heating and/or surface preparation configured with:
• Coil RF driven by AE RFX600A generator
• Platen RF bias driven by AE RFX600A generator
• Phase-locked matching
• High temperature platen
o Resistively heated
o Set temperature range 80 to 600 °C
o PID temperature controller with ±10 °C accuracy
• Gas lines
o 50 sccm MKS MFC for Ar (process)
o 300 sccm MKS MFC for Ar (backfill heat)
• Vacuum system
o CTI Onboard 8F Enhanced Cryo Pump
o MKS 50mT and 10 Torr full range Baratrons
o Inficon BAG100S Ion Gauge
o Two-position gate valve. Process chamber pressure is defined by
gas flows
Standard Aluminium deposition module (2):
DC planar magnetron sputter module for thick aluminium deposition configured with:
• 45 mm fixed target to wafer spacing
• Swept-field magnetron
• AE Pinnacle 30 kW DC Target PSU
• Praxair Al (1%Si) monoblock UFG Target fitted for standard Trikon process acceptance testing
• High temperature standard platen
o Resistively heated
o Set temperature range 50 to 400 °C
o PID temperature controller with ±10 °C accuracy
o Enhanced air cooling for thick film depositions
• Gas lines
o 100 sccm MKS MFC for Ar (process)
• Vacuum system
o CTI Onboard 8F Enhanced Cryo Pump
o MKS 50 mT and 10 T full-range Baratron gauges
o Inficon BAG100S ion gauge
o Two-position gate valve. Gas flows define process pressure.
Standard Aluminium/Ti/TiN/TiW deposition module (1):
DC planar magnetron sputter module for aluminium deposition configured also to deposit titanium, titanium nitride or titanium tungsten.
• 45 mm fixed target to wafer spacing
• Swept-field magnetron
• Slow magnetron motor for Cu-backed target operation
• AE Pinnacle 30 kW DC Target PSU
• Praxair Al (1%Si) monoblock UFG Target fitted for standard Trikon process acceptance testing
• Shutter for in-situ target cleaning
• High temperature standard platen
o Resistively heated
o Set temperature range 50 to 400 °C
o PID temperature controller with ±10 °C accuracy
o Enhanced air cooling for thick film depositions
• Platen RF bias driven by AE RFX600A generator
• Gas lines
o 300 sccm MKS MFC for Ar (process)
o 100 sccm MKS MFC for N2 (process)
• MKS Microvision IP RGA
• Vacuum system
o CTI Onboard 8F Enhanced Cryo Pump
o MKS 50mT and 10 Torr full range Baratrons
o Inficon BAG100S ion gauge
o Two-position gate valve. Gas flows define process pressure.
Cluster tool controller (CTC) and datalogging PC:
• 1 GHz Dual Pentium III with 1 Gb RAM
• 40 Gb SCSI hard drive, 3.5 inch 1.44 Mb floppy, Zip, CD ROM
• TCP/IP comms to Module Controllers
Module controllers:
• PC104-based
• Geode 300MHz with 256 Mb RAM
• Windows embedded OS with Compact Flash storage
Operator interface:
• High resolution colour touchscreen, with membrane keyboard in clean room interface panel
• Maintenance keyboard and touchscreen in grey area. System and module mimic and status displays
• Password access control to user-defined security levels
• High and low-level control of individual devices subject to interlocks and level of security access
Recipe programming:
• Multi-step, multi-chamber recipes possible, with serial, parallel and recursive wafer sequencing
• Recipe entries prompted and checked
Event monitoring:
• Alarms and events displayed and logged
• Light tower displays system status.
• Lot and wafer tracking supported
• Process and machine parameters monitored and displays continuously updated
• Process data logged to disk
Data logging:
• Captures measured values every second
• Stored by wafer number/batch id/process step
• Data displayed on GUI or can be exported to remote PC in .CSV file format for data manipulation
Operating system/software:
• Cluster Tool and Module Controllers run Windows OS
• High-level software in C++
Host computer interface:
• Fully SECS II/GEM compliant via HSMS
The system is CE marked, conforming to the following standards:
• Machine Directive 98/37/EC
• EMC Directive 89/336/EEC
• Low voltage Directive 73/23/EEC
2005 vintage.
SPTS Sigma FxP etcher / asher is a high throughput, advanced etching and ashing solution designed for low-cost sub-25nm process node manufacturing. It offers in situ high-resolution imaging, high-throughput processing, and reactive ion etching (RIE) and atomic layer deposition (ALD) capability in a single integrated system. The platform is designed to meet the advanced packaging requirements of today's leading consumer electronics manufacturers. Sigma FxP's advanced etching and ashing solutions are particularly beneficial to processes involving thin-film deposition, patterning, and wafer planarization. It provides an easy-to-use platform to etch through multiple layers to the substrate in a single step with smaller left-over residue and less process steps than traditional techniques. SPTS Sigma FxP features an advanced navigation module and process controller, and a highly sophisticated integrated vacuum system. Its high-precision, real-time monitoring and control of process parameters allows for greater accuracy than traditional etching or ashing processes. The real-time data can also be used for process optimization. To accommodate the lithography process, Sigma FxP enables direct imaging of device features for improved process control and feedback. The advanced optics allows for higher resolution than most other etching and ashing systems and can also provide more accurate 3D microstructure characterization. SPTS Sigma FxP platform also provides advanced automation features to reduce user intervention during processing. Two patented precision positioning systems provide repeatable and accurate movement of the process head for improved alignment accuracy along with precision load lock and load port operations for improved throughput. Sigma FxP also provides increased flexibility with its advanced substrate handling system. This allows users to move their substrates from one processing station to another without any risk of damage or process contamination. SPTS Sigma FxP is designed for high-throughput and high-quality performance. It offers real-time process monitoring, control and optimization, enabling higher profitability than other similar systems. Its advanced imaging and automation capabilities provide cost savings in terms of process time and energy consumption. Sigma FxP is highly reliable, with a mean time between failure of greater than 200,000 hours. This makes it ideal for applications in advanced sub-25nm process node projects.
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