Used STS / CPX 308PC #293826331 for sale

STS / CPX 308PC is a plasma etcher and asher which is ideal for the etching and ashing of hard materials such as metal oxides. This device has a high-power, precision controlled configuration that enables it to achieve tight etching specifications and excellent surface finish. It utilizes an advanced quartz chamber design and process chamber temperature control to precisely regulate etching processes. This versatile etcher and asher also offers vacuum bake out functionality to remove organic residues prior to etching. STS 308PC is powered by a multi-gas dynamic chamber with auto plasma ignition capabilities. This system is electronically divided into a plasma source assembly chamber (PEC), process pressure chamber (PC), and a gas baffle chamber (GBC). It permits the user to easily set and adjust operational parameters such as plasma type, power level, gas flow rate, and pressure. The automated process control ensures a consistent etch which is reproducible and accurate. This etcher and asher has a 25MHz RF generator that is controlled via a PLC (Programmable Logic Controller) and computer system. Through its PLC, user setup data is permanently stored and used to great accuracy in subsequent etching operations. The controller includes auto high voltage switch which ensures reliable performance and secure operation of the system. In addition, CPX 308 PC also has a high-temperature chamber with a built-in thermocouple to monitor the temperature of the chamber. This feature guarantees precise temperature regulation within the etching need for the highest quality results. Furthermore, the ergonomic design of this etcher and asher which maximizes space utilization while providing easy access to the two-way view port with shutter allows perfect visual checks on the status of etching operations. The chamber door can be opened and closed to facilitate sample loading and unloading. STS / CPX 308 PC is a powerful and versatile etcher and asher which offers precise, accurate, and dependable plasma etching and ashing operations. It features advanced state-of-the-art chambers, automatic processes controls, and a compact design for superior performance. It is an ideal device for a wide range of hard materials etching and ashing needs.