Used STS / CPX Multiplex ASE ICP #9398827 for sale

STS / CPX Multiplex ASE ICP (Inductively Coupled Plasma) etcher / asher is a state-of-the-art etching and ashing equipment that is designed to provide a wide range of patterning and surface processing applications. It combines multiple independent etch and ashing subsystems within a single integrated platform. STS Multiplex ASE ICP etcher / asher is designed to offer an alternative to manual ashing with its versatile opto-electronic system that provides simultaneous control of plasma conditions, gas flows and RF powers. The unit leverages ICP technology to realize an excellent etch uniformity across substrates and fine surface resolutions, while addressing etch and ashing requirements for high-density integrated circuit products. The machine includes multiple etch chambers in a single enclosure to enhance production yields. The 400 and 600 watt RF sources for STS Multi-Plex ASE allow for the plasma densities to be optimized for each etch step, providing a high level of control. Each step can have its own unique recipe, allowing for tightly controlled etch depths and feature sizes. CPX Multi-Plex ASE also provides advanced gas flow control to minimize waste of consumables and maintain tight process control. This is achieved with a powerful multi-stage gas flow control tool. The gas flow controller offers the flexibility to delineate up to 10 distinct gas recipes and process flows. STS / CPX Multi-Plex ASE also features a high-precision wafer loading asset, allowing maximum throughput and minimization of unproductive time. This model ensures wafer alignment and stability, while increasing throughput by up to 50%. In conclusion, CPX Multiplex ASE ICP is an advanced etcher / asher that offers improved yields and throughput compared to manual ashing. The equipment features ICP technology, RF sources, gas flow control, and high-precision wafer loading for fast, accurate and reliable etching and ashing of integrated circuit products.