Used STS / CPX Multiplex DRIE #9185199 for sale

STS Multiplex Deep Reactive Ion Etcher (DRIE) is a class of etchers specifically designed for precise and efficient etching of materials using plasma processing. It offers superior etching performance compared to other etching technologies, with exceptional repeatability, exceptionally high selectivity and high etch rates over a wide range of materials. The DRIE process involves the creation of highly directional plasma flows, which in turn guide the process gas through a substrate and produce trench profiles and wide ranging etch depths. STS / CPX Multiplex DRIE offers advanced features, such as independent controls for top and bottom substrate bias and gas flows, along with auto-tuning for the plasma etching parameters. This ensures that the optimum etching performance is achieved. The etching process is clean and efficient with minimal gas consumption, and therefore cost-effective. In addition, STS Multiplex DRIE is capable of processing large wafers at high throughput, making it ideal for production environments. The multiple pass feature allows the wafers to be processed simultaneously in both etching and passivation cycles. Furthermore, the DRIE has a fully automated cassette loading system, making it incredibly easy to use. The automation features of CPX Multiplex DRIE make it possible to customize the etching process for maximum optimization. The built-in computer interface offers numerous options, such as adjustable bias levels, etching time, gas flow, temperature and pressure. Furthermore, the real-time control system allows for quick optimization of the etching parameters for more efficient performance. Overall, Multiplex DRIE is a powerful etching tool that combines precise etching performance, exceptional repeatability and high etch rates. It is an invaluable tool for various etching processes, such as creating trenches, forming high aspect ratios, creating channels and profiled features. STS / CPX Multiplex DRIE allows for efficient, precise and cost-effective etching of various materials.