Used STS / CPX Multiplex ICP #293609292 for sale

STS / CPX Multiplex ICP is an etcher and asher technology used to create high-quality microelectronic components. It is a benchmark technology for the industry that offers high throughput rates, reliable process results, and reduced material cost. This technology has a modular design that can be adapted to the customer's specific needs. STS Multiplex ICP is a plasma etcher and asher designed to manufacture semiconductor wafers and proceed MEMS structures, including photoresist and etch masking layers. The equipment utilizes advanced ICP (Inductively Coupled Plasma) technology, which can be tailored for various plasma processes such as dry etching, wet etching and ashing. It also has the ability to be triggered and controlled by a PC base controller. CPX Multiplex ICP is a single-chamber system that contains both etching and ashing capabilities. The etching process is based on a low frequency inductively-coupled pneumatic microwave source. This means the unit can effectively manage etching steps without the need for separate chambers. The machine utilizes a special technology to evenly spread the plasma over the large substrate area. This provides precise control of the etching process and allows consistent results. The ashing process is based on a standard atmospheric pressure chemical oxygen. The tool is also equipped with automatic wafer loading and features a high throughput of up to 12 wafers per hour. It has a precise temperature control asset, which maintains stable temperatures to prevent any thermal damage on the substrate. It also has advanced processing monitoring capabilities to ensure repeatable results. Multiplex ICP is an ideal solution for high-performance microelectronic applications. It is easy to integrate with various process monitoring systems and is compatible with various software programs for precise processing control. This etcher and asher model offers excellent repeatability and high throughput, providing improved productivity, cost savings, and enhanced yield.