Used STS / CPX Multiplex ICP #293619106 for sale

STS / CPX Multiplex ICP is a state-of-the-art, large scale etcher/asher equipment from Applied Materials. It is a fully integrated multi-beam system that integrates an ion source, a magnet-optical configuration and a high-precision deposition platform for precise crystalline film depth control. The unit is equipped with a dual ion source, capable of processing a range of materials from germanium to gallium. The dual source allows for simultaneous etching of two layers, achieving a more precise etch profile than a single source. It also offers a wide range of etch gases, enabling the capability of processing a variety of materials. The ion beams can be focused to the site with high precision, enabling both high quality etch profiles and low defect rates. The substrate holder design provides a stable platform for the precise control of the substrate deposition. The machine utilizes a high powered magnet-optical configuration with an adjustable magnet power, allowing for extremely precise etch profiles and precise crystalline film thickness control. This tool offers precise control of the etch profile as well as an etch rate of up to 800 nm/min. The high power enables precise control of the ion beam parameters, including ion energy and range, beam diameter and scan speed to increase process control. Additionally, the Angle Dispersion Limiting device helps reduce the adverse effects of secondary ion scattering and ensures the precise shape of the etched feature. STS Multiplex ICP features advanced plasma control, allowing the asset to reach ultra high vacuum rates with low in-situ residual gas pressures. This model also offers an innovative ceiling mounted plasma controller, allowing for improved reproducibility and simplified recipe development. Finally, this equipment comes with a comprehensive integrated software package which includes a modeling toolkit and a user interface. The modeling toolkit assists engineers in optimizing their etch processes, while the user interface facilitates recipe writing and execution for quick process development. It also allows for single-recipe processing of many different materials and substrates. CPX Multiplex ICP is an ideal etcher/asher for any industrial or research application. Utilizing a dual ion source, advanced plasma control and a high-precision deposition platform, this system provides precise control of the etch rate and feature geometry, making it well suited for the most demanding etch processes.