Used STS / CPX Multiplex ICP #293684725 for sale

STS / CPX Multiplex ICP is an etcher/asher designed for high-precision etching and ashing processes, ideal for the laboratory environment. The etcher/asher features an integrated, modular design with a digital temperature, gas and pressure control. STS Multiplex ICP uses ionized, or plasma-based etching and ashing technology using argon, xenon or krypton gases to achieve extremely precise etching processes on a wide range of substrates. The equipment utilizes a mix of pulsed DC electricity and a specific radio frequency (RF) to create ionized particles, or plasma, which is then delivered to the surface of the substrate. The precise frequency ensures that just the right temperature and density of plasma is achieved to achieve the precise etching and ashing processes required. The system utilizes multiple channels of power delivery to ensure precise and even plasma delivery, ensuring the precise etching or ashing of even the most sensitive substrates. The precise plasma and power delivery of CPX Multiplex ICP can etch and ashe even the most delicate substrates with no risk of damage. The unit operates at variable frequency and power levels allowing the operator to tailor the etching process to the substrate's type and thickness. The precision of the etching and ashing process of the machine is further improved by the inclusion of a variable frequency tuning which helps to maintain a consistent process yield and repeatability across multiple targets and substrates. The tool is also highly accurate and versatile, boasting a process window of up to 10,000cm/s, temperature and pressure control of up to 400 degrees Celcius and 0.001mBar, respectively. The versatile power delivery asset of Multiplex ICP allows for a wide range of etching and ashing processes to be completed on various substrates. STS / CPX Multiplex ICP from STS is a highly accurate and versatile etching and ashing model, tailored for the laboratory environment, providing precision etched and ashed workpieces, even on the most delicate substrates. The equipment boasts digital temperature, gas and pressure control, multiple channels of power delivery and variable frequency tuning to ensure precise and repeatable etching and ashing processes. The etching and ashing process of the system can be completed at up to 10,000cm/s and temperatures of up to 400 degrees Celcius.