Used STS / CPX Multiplex ICP #293807045 for sale
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ID: 293807045
Wafer Size: 3"-8"
Vintage: 2001
Etcher, 3"-8"
ESC Chuck
JULABO HT60 Heater
Ceramics
Spare modules
(2) Weighted clamps
Gas configuration:
Gas / Size
SF6 / 50 SCCM
He / 300 SCCM
Ar / 100 SCCM
O2 / 100 SCCM
SF6 / 600 SCCM
C4F8 / 400 SCCM
Does not include:
Rough pump
Chiller
2001 vintage.
STS / CPX Multiplex ICP is an etcher / asher. It is designed to offer precision etching, ashing, and physical / chemical processing. The equipment utilizes multiplexed reaction chemistries for greater efficiency and control. STS offers superior etching and ashing performance with etch rates up to 20nm/min, and optional N2O Low Energy Non-Contact Etching (LENTE) capabilities. The multiplex chamber system provides automatic and precise etch step definition with the ability to perform complex etch sequences in multiple etch chambers in parallel. The batch size of the unit is up to 24 substrate units of 200mm (8 inch) with an orientation as-oriented, or as-sealed in Si carrier with up to 1500W RF power. The chamber design of the ICP includes one reaction chamber equipped with several inductively coupled plasma sources that can run independently of each other enabling the machine to easily switch between multiple etch or ashing chemistries. The tool is equipped with automation functions such as recipe definition, autofocus, and run-time X-ray monitoring of a quartz sensor plate that is used for precise thickness control and depth profile manipulation. Additionally, STS Multiplex ICP offers unique thermal management capabilities, such as the adoption of four high-performance fans to optimize heat exchange efficiency and the selection of cooling time and temperature. The ICP design also allows users to choose their preferred wafer approval asset. An external closed-loop servo scanner can be used for wafer-by-wafer load and unload operation, or an integrated automatic wafer load scanner can be utilized for an automated process. Furthermore, the ICP is equipped with an internal power supply and control model, allowing users to customize their process parameters for maximum repeatability. CPX Multiplex ICP is designed for use in the fabbing and packaging of MEMS, RF-MEMS, semiconductors, and integrated circuits. It is an ideal solution for a variety of applications, from high precision etching, ashing and physical / chemical processing to the rapid production of high-quality devices. The ICP's advanced design, performance, and flexible capabilities make it an ideal choice for a wide range of etching and ashing applications.
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