Used STS / CPX Multiplex ICP #9243850 for sale
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ID: 9243850
Wafer Size: 6"
Vintage: 2001
Plasma etcher, 6"
ICP Process chamber
Chamber
Coil RF generator and matching unit
Electrode RF generator and matching unit (Platen)
Phase shift controller
VAT Isolation valve
Turbo pump
EDWARDS QDP40 Dry pump
Gas box
Cluster multiplex Prime Power Distribution (PPD) cabinet
Process chamber electronics
Materials processed: Si, SiO2, Al2O3, Ta, Ti
Process gases: CF4, SF6, Ar, O2, H2
Missing parts:
(2) Control modules
Exhaust pipe
Matching box
MAG / Phase detector
Load port
Power supply: 208 VAC, 60 Hz, 8.32 kVA, 3-Phase
2001 vintage.
STS / CPX Multiplex ICP is a state-of-the-art etcher/asher equipment designed by Oxford Instruments for a wide variety of semiconductor manufacturing and laboratory applications. The system is built with a proprietary etching reactor and associated computer controls and software. STS Multiplex ICP unit offers higher rate etching than other etching systems on the market, while maintaining the necessary control and uniformity of etch profiles and features. CPX Multiplex ICP machine features a microwave-induced plasmas (MIP). The MIP technology is proven to have the most uniform etching of all etch systems. The MIP tool produces extremely uniform substrate profiles and features with extremely low ion bombardment as well as providing high repeatability. The asset is designed to accommodate either an EF or DC power supply which allows for greater flexibility in the application process. Multiplex ICP model also includes software that allows a user to automatize the etching process. The software offers a wide variety of parameters that can be controlled in the etching process, including etch time, pressure, temperature, and flow. Additionally, the equipment utilizes a shut-off valve that ensures that etching stops when the process is complete. This allows for precise control of the etching process and improved product yield. STS / CPX Multiplex ICP is designed to be used in various laboratory and production applications, such as etching of trench isolations, lamination, fine line metallization, and via etching, among others. It also offers a glovebox option to handle corrosive gases. STS Multiplex ICP is a highly versatile system that can be tailored to specific etch and deposition requirements. The unit offers consistently high quality etch profiles with low ion bombardment, ensuring optimal device performance. With the latest digital technologies and software, users can program a process to run unattended, making it simple to etch high quality substrates with exceptional uniformity and repeatability.
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