Used STS / CPX Pegasus #293597735 for sale
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ID: 293597735
Wafer Size: 8"
Vintage: 2006
Etcher, 8"
(2) Chambers
Power Distribution Unit (PDU)
Cluster Tool Controller (CTC) Cabinet
(3) Rotary pumps
(2) Turbo pumps
(3) SMC HRZ-001 Chillers
Process module (PM2, PM3):
Source assembly
Lower assembly
Electrode assembly
External component
Gas box
MKS RF Generator, 6.5 kW
MKS / ENI ACG 3B RF Generator, 13.56 MHz
MKS Baratron gauge, 10^-4 to 10^-1 mTorr
MKS 750 Capacitance, 10-760 Torr
BOC EDWARDS Active gauge, 10^-4 mTorr to 10 Torr
Ceramic ESC
Pumpdown, 500 mTorr
APC Valve open
Load lock pump down, 80 mTorr
Gate valve open
Temperature: ±2° C
Forward power: ±1 % Vibration
Ref power: ±1% Vibration
Gases: SF6, C4F8, O2, N2, Ar
Flow rate (±2 % Vibration):
Gas / MFC
C4F8 / 400 SCCM
SF6 / 1200 SCCM
Ar / 500 SCCM
O2 / 200 SCCM
He / -
Transport module (TM):
MX600 Handler
Vacuum Cassette Elevator (VCE)
Safety node
Tracking optics
Inligner
(4) Coolers and (4) heaters:
House water
SMC HRZ-L2-DY DI Water chiller
SMC HRZL-D Silicon oil chiller
Insert heater
Gas tubes has been replaced
Power supply: 380 V, 60 Hz, 160 A
2006 vintage.
STS / CPX Pegasus is a high performance etcher/asher equipment offered by the Semflex Group that provides a range of advanced etching and ashing processes for a variety of substrate materials. The system is based on the latest electromagnetic etching and ashing technologies, and has been designed to provide consistent, repeatable, and high-quality results for a wide range of etching and ashing applications. STS Pegasus unit consists of an advanced multi-station handling robot, an etching chamber, an ashing furnace, and a number of advanced control and monitoring systems. The machine is capable of working with a number of different substrate materials and can handle wafers up to 500 mm in size. The etching chamber is designed to provide ultra-high-density etching, while the ashing furnace is designed to offer high-efficiency, controllable, and safe ashing operations. The multi-arm robot is used to transfer wafers between the etching chamber and the ashing furnace. Its sophisticated design is capable of controlling the wafer spin, as well as ensuring precise sequencing and positioning of the wafers throughout the entire etching process. The robot is also capable of recognizing, loading, and unloading wafers and can control a variety of additional processes, such as wafer cleaning, orienting, and aligning. The tool is designed with a range of security and safety features, including advanced temperature control systems, air and gas flow protections, as well as monitoring and safety interlocks. These features help minimize any potential risks during etching operations, and provide a secure and safe experience for operators. CPX Pegasus asset is also designed to maximize the quality and integrity of wafers processed within it, while offering great flexibility and process control. With its innovative nanotechnology and advanced control systems, the model provides an unprecedented level of precision and repeatability when etching and ashing. All these features, along with the equipment's versatility, make it the ideal solution for etching and ashing processes for a wide range of application surfaces.
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