Used STS Multiplex ICP HR #293609291 for sale

STS Multiplex ICP HR
ID: 293609291
Deep Reactive Ion Etcher (DRIE).
STS Multiplex ICP HR is a precision etching and ashing machine designed for use in high-precision applications. The machine uses high-resolution laser etching technology to remove materials from a variety of substrates and then ashing to achieve an extremely precise surface finish. The machine has a large working area of up to 10" x 10" and is capable of achieving etching resolutions down to 0.001" (25μm). It is ideal for creating complex patterns on a variety of substrates including glass, ceramics, plastics and other non-metallic materials. Multiplex ICP HR is a fully automated etching and ashing machine that utilizes advanced laser optics to accurately etch and ashe substrates with minimal work piece distortion. It is designed to produce highly precise patterns with minimal user intervention. The machine is able to etch at a maximum rate of 180 mm/s and has an adjustable spot size to accommodate different etching requirements. It has a depth of etching up to 1mm and its sophisticated control software allows for complex etching patterns to be programmed and stored. STS Multiplex ICP HR also features an in-cab self-contained nitrogen purging system to reduce residue build-up and contamination. It is also designed with an integrated air filtration system to reduce dust and harmful gas emitted during etching and ashing processes. The machine is also outfitted with a vacuum table for mounting the substrate which ensures that the substrate is firmly held in place during the etching process. Multiplex ICP HR utilizes a highly efficient laser beam that can be focused on the substrate surface with extreme accuracy. This ensures that the resulting etchings are extremely precise and detailed. The machine also has a high repetition rate of up to 60 Hz which allows for quick production times along with excellent etching and ashing accuracy. Overall, STS Multiplex ICP HR is an advanced etching and ashing machine that provides precision results at high production speeds. It is ideal for applications that require accurate etching of complex patterns on various substrates and is capable of achieving resolutions of 0.001" (25μm). Its sophisticated software, nitrogen purging and air filtration systems eliminate dust, residue and unwanted overheating.
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