Used STS Pegasus DRIE #293596360 for sale

STS Pegasus DRIE
Manufacturer
STS
Model
Pegasus DRIE
ID: 293596360
Wafer Size: 4"
Etcher, 4" Bosch Process Upgrade for up to 8".
STS Pegasus Deep Reactive Ion Etcher (DRIE) is a robust, high-performance production etcher/ asher that is capable of delivering deep reactive ion etch (DRIE) processes to precisely create features with high vertical aspect ratios. The plasma source of STS Pegasus DRIE etcher produces highly energetic ions directed with precision to the workpiece surface. These highly energetic ions are used to etch the targeted areas of a substrate, while the graphite wall shield is used to protect other areas from the etching process. At the core of Pegasus DRIE's cutting-edge technology is a high-voltage power supply and a powerful 2.45GHz microwave plasma source. Its advanced source, specially designed for DRIE processes, produces multiple ions species with high gas utilization efficiency. The equipment is built using all digital controllers paired with sophisticated algorithms for process control, enabling users to monitor and control their recipes in real-time. The power supply of STS Pegasus DRIE etcher is specifically designed to provide efficient and repeatable process recipes with exceptional accuracy. Variables such as chamber temperature, pressure, and power are precisely managed within polymer processing protocol. In addition, Pegasus DRIE etcher is equipped with a DCMS CoreShield which is a set of specific safety features that also aids in the precision of the etching process. This includes a dual-pressure differential system that measures the pressure between the process chamber and the exhaust line and the automatic shut-off unit which stops the process when it detects an excessive pressure differential. STS Pegasus DRIE etcher is well suited for a wide variety of substrates including silicon, quartz, glass, ceramics and other materials. This multi-substrate platform provides maximum compatibility for various product designs. The etcher supports a broad range of feature sizes and is capable of finely controlling etch profiles as well as high aspect ratios. The entire machine is flexible enough to handle a variety of applications such as large area substrates, small area substrates including patches, wafers, and even hard non-porous materials including metals and glass. Overall, Pegasus DRIE is the most reliable and advanced etching tool for high aspect ratio, deep reactive ion etching processes. With its advanced source, power supply, and safety features, users can achieve maximum precision and accuracy with their process recipes, as well as reliable, repeatable results.
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