Used STS Pro ICP #293605254 for sale

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Manufacturer
STS
Model
Pro ICP
ID: 293605254
Wafer Size: 6"
Advanced Oxide Etcher (AOE), 6" Inductively Coupling Plasma (ICP) Backside helium cooling 8-Pins clamp Lip seal Masks: Si, PR, Metals (Cr, Ti, Ni) Gases: C4F8, SF6, O2, H2, CF4, (2) Open gas slots Process pressure: 2-80 mT Substrate size: 6" Temperature range: Platen: -20°C to 120°C Walls: 100°C Lid: 120°C Materials etched: SiO2 Quartz Pyrex Fused silica Si3N4 Bulk silicon Capabilities: 2.5 µm on 8-10 µm TEOS Etch rate: >2000 A/min SiO2, >4:1 selectivity SiO2: PR Inter wafer: ±3% 5 µm on 3-10 µm SiO2 Etch rate: >3000 A/min SiO2, >7.5:1 selectivity SiO2: PR Inter wafer: ±2% Power supply: ADVANCED ENERGY Coil: 3000 W, 13.56 MHz ENI Platen: 1000 W, 13.56 MHz.
STS Pro ICP is an advanced etcher / asher that is well-suited to ICP (Inductively Coupled Plasma) applications. It is expertly designed to provide precise, efficient, and expansive etching capabilities with ultra-fast etch times and tight control over critical process parameters. Pro ICP features a 12" x 13" (approx. 30.48cm x 33.02cm) active etching table, with a modified slit valve etcher by which to control the process gases and pressure of the etching stage. The etching table is equipped with full bottom-view camera monitoring to allow for precise control of the process. An added feature of this etcher are the "bake-in" capabilities of the table top providing thermal process control for a full range of etch processes. The heart of STS Pro ICP is the RF Generator and ICP source assembly. This assembly also includes the load-match network and motorized power settable capacitors for providing precise and reproducible control of the ICP source. The process chamber of Pro ICP is made from titanium, which provides a durable and effective etching environment. Once the wafer is placed in the chamber, the etch process can be initiated by simply pressing a few buttons on the table top. STS Pro ICP also features a process gas supply with mass flow controllers, a methane/nitrogen/argon mix, and a variable frequency drive to precisely regulate the ICP source and match it with the load. In conclusion, Pro ICP is an advanced and versatile etcher / asher, well-suited to ICP (Inductively Coupled Plasma) applications. Its robust design, precise control, and wide range of etching capabilities make it an ideal choice for general and precision etching needs.
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