Used STS Pro ICP #9222701 for sale

Manufacturer
STS
Model
Pro ICP
ID: 9222701
Wafer Size: 2"
Vintage: 2008
Etcher, 2" Process: InP Etch Etch chamber Clamp type: SEMCO ESC LEYBOLD Turbo pump VARIAN Scroll pump Pallets, 4" Gases: N2 O2 Cl3 & Argon 2008 vintage.
STS Pro ICP (Inductively Coupled Plasma) etcher / asher is an advanced etching equipment dedicated to the microelectronic industry. It is used in the manufacturing process of integrated circuits and display panels, as well as for other nanotechnology applications. The high-precision etching system is designed to deliver extremely precise results on a range of materials including polyimide. Pro ICP primarily relies on the plasma etching process for consitency in results. The main components of the unit include the plasma generator, RF power supply, plasma chamber, load lock chamber, and the support hardware. The plasma generator uses a vacuum turbomolecular pump to generate plasma by inducing electrical currents in reactive gas molecules. This generates radicals, ions, atoms, and energized particles that allow for the process of etching and improving surface adhesions secondary to bonding. To process substrates, the machine utilizes argon gas, which is heated to high temperatures, in order to activate the RF power needed to create the plasma. Inside the plasma chamber, the affected gas is cooled and condensed to the desired degree. Depending on the material being processed, highly controllable temperatures of 150° to 700° C (302°-1290° F) are achieved via the thermal control tool, giving complete thermal flexibility and control in the etching of high performance materials. STS Pro ICP asset is also equipped with powerful and precise pressure control, which allows for precise control of load locks, purge systems, and dry pumping. This offers versatile and dedicated control while maintaining the highest level of safety. Additionally, the model has an in-vacuum preview scanning electron microscope for process verification. Pro ICP is the perfect solution for precise and repeatable etching processes for microelectronic applications. It offers excellent process control to ensure uniform etching on a variety of materials. The equipment's precise features and reliable results make it ideal for use in high demand applications.
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