Used STS Pro ICP #9361815 for sale

Manufacturer
STS
Model
Pro ICP
ID: 9361815
Wafer Size: 2"-4"
Vintage: 2008
Etcher, 2"-4" Process: InP etch EDWARDS IH80 Pump LEYBOLD HERAEUS Turbo pump VARIAN Scroll pump on load lock Gases: N2, O2, Cl3 and Argon Clamp type: SEMCO ESC Single chamber 2008 vintage.
STS Pro ICP is an etcher/asher designed for industrial high-throughput production. It is equipped with advanced features, such as adjustable process parameters, layer selectivity, and lower chamber heating, which enable precise control of process recipes. The platform utilizes RF induction heating technology, which allows it to operate in a range of frequencies from 0.1 to 1000 MHz. The maximum processing power is up to 700 W, while the maximum temperature range is 700-1200°C. The equipment is programmable to support a variety of process recipes, including dry process etching and ashing, wet and dry patterning, oxide deposition, and higher-layer etching. It also includes advanced features such as in-bed profiling and high-performance plasma etching. The integrated controller has an intuitive graphical user interface, making the system easy to use and set up. The easy-to-use software provides a wide range of flexible process parameter setting options, while advanced process control algorithms enable excellent stability and process repeatability. Pro ICP includes a suite of safety features, as well as interlocks and full monitoring functions. It is equipped with a diagnostic unit for easy troubleshooting and preventative maintenance purposes. In addition, the machine can be used in a number of automation configurations, including an inline tool for continuous production and a batch asset for greater flexibility and job tracking. The model is expandable to match the throughput and versatility requirements of different applications. Overall, STS Pro ICP is a reliable, user-friendly etcher and asher suitable for industrial high-throughput production. The advanced features, safety features, and automation capabilities offer increased flexibility and improved process control and repeatability.
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