Used STS / SPTS Multiplex ICP #293608878 for sale

STS / SPTS Multiplex ICP is a versatile, cost-efficient etcher/asher equipment used to fabricate integrated circuits and other specialized electronic components. This equipment uses a reactor-based system that combines sub-atmospheric pressure (STS) and rapid thermal processing (RTP) with a multiple source of inductively coupled plasma (ICP). With this process, extremely thin layers of material can be accurately etched for the fabrication of high-density, sub micron elements required for advanced application such as multi-dimensional beam lead routing and interconnects. STS Multiplex ICP etcher/asher uses an inductively coupled plasma (ICP) source to provide a uniform, controllable etch environment. The ICP source generates high-energy electrons and ions to generate a plasma field that can be used to etch and pattern conductive material layers. The ICP power can be adjusted to increase or decrease the etch depth. By optimizing the ICP power, one can obtain the desired etch rate and profile. SPTS Multiplex ICP etcher utilises a Dual Reaction Chamber (DRC) that provides an exceptionally uniform etching environment for extremely thermally sensitive applications. Inside the DRC chamber, a Sub-Atmospheric Pressure Treatment System (SPTS) reduces etch pressure reducing damage to the substrate. STS / SPTS also helps to prevent the migration of etched material from the etch chamber. The reaction chamber also includes a Load Lock chamber that provides easy transfer of substrates from outside to inside the etch chamber. Multiplex ICP etcher/asher offers a wide range of features for process control, including dual-gas bias, temperature control, gas flow control, rate of heating, and post etching. This makes it possible to accurately control the processing parameters to achieve optimal performance. STS / SPTS Multiplex ICP etcher/asher is highly efficient, with a throughput rate of several hundreds of parts per hour, and has high precision through its OPC (overlay process control) with an accuracy of fractions of a micron. Additionally, the multiplex ICPA setup allows the operator to use up to four independent ICP sources with their own substrates and process parameters, or a single substrate with multiple etch masks. In conclusion, STS Multiplex ICP etcher/asher is a versatile and reliable equipment which has a wide range of applications in the production of advanced electronic components. The equipment is cost-effective and highly efficient in producing submicron features with high precision, and its process control features ensure a high level of etching accuracy when compared to traditional etching systems.