Used STS / SPTS Multiplex ICP #9277059 for sale
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ID: 9277059
Wafer Size: 6"
Reactive Ion Etcher (RIE), 6"
Process: BOSCH
Type: Automatic
Multiplex ASE-HR, 6”
EBARA A30W Dry pump
EBARA AAL10 Dry pump
No chiller
Chamber:
BOSCH Process
Gas line:
MILLIPORE FC2901 4V Viton 600SF6/300C4F8/100N2/100N2
ENI ACG3B-06 / AS310424
Power supply: 300 W, 13.56 MHz
RF Supply / Matching unit:
ENI ACG3B-06 / AS310424
Power supply: 300 W, 13.56 MHz
ADVANCED ENERGY MN3150011-000N SE / AS306817
Power supply: 500 W, 400 KHz
Chamber substrate, 6"
TRIPOD Mechanical wafer clamp electrode
With He backside cooling
Process chamber:
ICP V2 Unified ISO250
With 100 adapter
LEYBOLD MAG2000CT Turbo pump
EBARA A30W Dry pump
Chamber externals
Includes:
EDWARDS D14641000 Gauge
SMC ZSE6B Pressure switches
MKS E27B17DD5B
NW16 Bypass pump line
Gas box
Lower electrode:
ICP WTC TRIPOD Lift
Substrate clamping / Platen: ICP WTC TRIPOD, 6"
Includes:
MKS 750B11T 10T
MKS 1179A51CR1BV-S: 50 sccm
Upper electrode with aperture mounting
Upper electrode source: ICP Balun
Upper RF enclosure / MU: Balun, 1 kW
Chamber lid: ICP Heated
RF Generators:
Upper: ENI ACG3B-06 / AS310424
Power supply: 300 W, 13.56 MHz
Lower: ADVANCED ENERGY MN3150011-000N SE / AS306817
Power supply: 500 W, 400 KHz
TTI / THURLBY THANDAR INSTRUMENTS TGP110 Pulse generator
Frequency: 10 MHz
Bypass pumping: Automatic NW16
Heated foreline: ICP
NW40 Pumping line
Gasbox: Minimum (4) lines with PFC1 module
EBARA A30W Dry pump
Gases / MFC Size (sccm) / Seal type / Gas type
C4F8 / 300 sccm / Viton / Clean
SF6 / 600 sccm / Viton / Clean
N2 / 100 sccm / Viton / Clean
N2 / 100 sccm / Viton / Clean
Loadlock:
Carousel vacuum loadlock
Carousel loadlock parts: (2) Substrates, 6"
EBARA AAL10 Dry pump
Power supply: 208 V, 3 Phase, 60 Hz.
A STS / SPTS Multiplex ICP, also known as a Simultaneous Time-Sharing Simultaneous Parallel Time-Sharing Multiplex Ion-Etch Asher, is a specialized etcher and asher used to precisely etch and ash micro- and nano-scale patterns. It can be used to modify the microstructure of small and complex shapes and is used in applications such as MEMS, microfluidic, and 3D printing. STS Multiplex ICP has a high-power RF generator that generates a stream of high-frequency, high-power ions. These ions precisely etch away material in a material removal process, while the ICP's on-board gas delivery equipment ensures that gas flow is evenly distributed throughout the process. In addition, the ICP's efficient computer-controlled timing system keeps the etching and ashing process in sync, preventing repetitive processes from causing any interruption or damage to the unit. SPTS Multiplex ICP also provides precise control over deposition thickness and uniformity. The ion stream can be adjusted to target specific areas that require deposition, while also offering flexibility to adjust the stream's velocity, ion density, and flow rate as needed. This provides users with unparalleled precision and allows them to create intricate patterns with little risk of contamination. Multiplex ICP's computer-controlled software allows users to program process parameters according to their specific application needs. This gives users the ability to customize their etching and ashing processes to meet the exact requirements of their project. The software also tracks machine performance and allows users to manage their process data, ensuring that each project is successfully completed. In conclusion, STS / SPTS Multiplex ICP is a specialized etcher and asher that provides superior precision and control for etching and ashing micro- and nano-scale patterns. It is an ideal tool for researchers and engineers looking for a reliable and advanced etching and ashing solution.
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