Used TEGAL 415 #5672 for sale

TEGAL 415 is an advanced etcher / asher equipment well-recognized for its high-speed, repeatable and ultra-fine processing. It is the ideal equipement for precision processes including MEMS, thin-film and high-aspect ratio structures in the micron to nanometer range. 415 has a modular platform designed for both wet and dry etching. The wet etching is a plasma-enhanced process in which chemicals or gases are ionized with a high-frequency electric field, achieving fast, precise and selective etching. Dry etching utilizes advanced, highly reliable technologies such as reactive ion etching (RIE) and plasma etching for depth control and high aspect ratio processing. TEGAL 415 is capable of producing precise features with uniformity of ±3% across a 4-inch wafer. High throughput is achieved by minimum etch times and high optimization of the process. Pressure outputs as low as 0.01 Torr can be obtained and maintained during the etching process, leading to high repeatability. 415 is a powerful and precise etcher that is compatible with a wide range of, materials and applications. It utilizes a retractable chamber that minimizes the risk of particle contamination and a front-end loading system that eliminates wafer transfer. To ensure wafer protection during etching, the unit is embedded with electrical and mechanical signals that report chamber conditions including temperature (up to 100˚C) and speed. In addition, the machine is equipped with a top-of-the-line safety tool which includes automated gas shut-off and variable pressure clamping beds to protect against pressure build-up and unsafe conditions. This setup also allows for quick and easy maintenance and servicing. The modular and easy-to-use interface allows for a variety of etch recipes to be run in both batch and single wafer modes, making this asset suitable for both development and production environments. With a minimal footprint and excellent cost-effectiveness, TEGAL 415 can prove to be a great addition to a lab or facility that processes MEMS, thin-film, and high aspect ratio structures.