Used TEGAL 6550 #9155217 for sale
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ID: 9155217
Wafer Size: 8"
Vintage: 2003
Reactive Ion Etcher (RIE) system, 8"
Platform: Rinse / Strip, through-the-wall, signal tower
PDM: Standard
System includes:
(2) Patented spectra plasma process modules
Standard ceramic electrostatic clamp (200 mm)
High temperature electrostatic clamp (200 mm)
(2) Integrated diode array optical analyzers
(2) Recirculating temperature control units
Vacuum cassette elevator loadlock
Core vacuum transport module with robot
Wafer aligner module
ICP Strip process module
Spin rinse / Dry process module
Atmospheric transport module with robot
Remote RF generator cabinet
Remote power distribution module
Integrated human interface and control system
Remote LCD interface module
Cleanroom signal tower (3 Color standard)
PM 1: Spectra 1.0, Special HT-ESC
MFC Type: MYKROLIS TYLAN FC2900
Gas 1: BCl3, 0-200sccm
Gas 2: Cl2, 0-50sccm
Gas 3: SF6, 0-50sccm
Gas 4: HBr, 0-50sccm
Gas 5: CF4, 0-50sccm
Gas 6: Ar, 0-200sccm
Gas 7: He (Water temperature control)
LF Generator: 600 watts
HF Generator: 1200 watts
Gas injection: Open ring
PM Turbo pump: 1000L/s
End point: Diode array
LE Temp range: Filtered house cooling water
PM 2: Spectra, special high vacuum mod's
MFC Type: MYKROLIS TYLAN FC2900
Gas 1: Spare
Gas 2: Spare
Gas 3: He, 0-200sccm
Gas 4: Spare
Gas 5: Ar, 0-100+sccm
Gas 6: Ar, 0-500+sccm
Gas 7: He (Water temperature control)
LF Generator: 300 watts
HF Generator: 1200 watts
Gas injection: Open ring
PM Turbo pump: 1000L/s
End point: Diode array
LE Temperature range: Noah precision: GALDEN PFPE HT170
PM 3: ICP Strip module
MFC Type: MILLIPORE TYLAN 2900
Gas 1: O2, 0-2000sccm
Gas 2: N2, 0-500sccm
Gas 3: He, 0-500sccm
PM4: DI Water rinse module
Gas 3: PM3 (strip)
Gas 4: PM2 (etch)
Gas 5: PM2 (etch)
Chambers:
ICP Cl2 / CFxHy Etch chamber (primary etch chamber)
ICP Low-voltage Ar mill "SOM"
Anti-corrosion treatment used with He / H2 or N2 / H2
Anti-corrosion water rinser
O2-Based asher
EDWARDS QDP-40,80
Gas reactor column EDWARDS M150
CE Marked
AC Supply: 400 V, 3 Phase, 50 Hz, 5 wire
2003 vintage.
TEGAL 6550 is an etcher/asher, designed for both frontside and backside wafer processing. This system offers a highly efficient and cost effective way of creating 3-dimensional patterns within the substrate layer. 6550 enables highly selective processing, utilizing both dry and wet etching. The etcher/asher features a 3-dimensional field of view within the substrate, creating precise patterns without causing any physical distortion of the layer. It also features a 6-position high-resolution mechanical shift, which is ideal for automatic and manual alignment. TEGAL 6550 has an adjustable speed for the substrate shift rate, as well as a laser scanning system for tracking wider patterns. The etcher/asher utilizes an advanced computer-controlled platform, with networking capabilities available for integration into other systems. In addition, 6550 is equipped with a built-in software package for performing different etching tasks. This package is user-friendly and intuitive, making it easy for users to understand and optimize the etching procedure. TEGAL 6550 comes with a wide variety of components, including driver boards, power supplies, and cooling systems. It also offers an integrated, isolated RF generator to boost the throughput of the etch process. This feature ensures the maximum level of control over the etching process. 6550 also features a number of advanced safety features, including an automatic power-off feature, which turns the system off when not in use, as well as a built-in ETCHER security switch which enables access to only approved users. All in all, TEGAL 6550 is an advanced etcher/asher designed for high-precision substrate processing. It is highly reliable and cost-effective, and comes with all the features needed for precise and accurate etching.
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