Used TEGAL 903E #9113440 for sale

TEGAL 903E is a diode-pumped solid-state (DPSS) etcher equipment designed to meet the demands of high-throughput, high-volume advanced packaging applications. This etcher is equipped with innovative features and technologies that ensure repeatable and reliable performance. TEGAL 903 E is designed to provide rapid thermal cycling and rapid etching without compromising accuracy or repeatability. The system is capable of etching a variety of substrate materials including FR-4, FR-5, Polyimide, RF materials, quartz, plastic and metals. It can also be used for 3D micro-machining, and metallization of plastic and hard substrates. 903E has a patented waveguide design that enables it to achieve high etching accuracy and repeatability, as well as high through-put. The unit can achieve peak power of up to 250KW, with a standard maximum average power of 50KW. In addition, 903 E is flexible enough to support a variety of waveform formats, such as stepped wave, chirp wave, and variable power waveform. The machine is equipped with an expanded chamber size and shallow profile, allowing for high-throughput processing in a compact footprint. For further flexibility and performance, the chamber can be configured with an open or enclosed deck, and additional integrated components, such as multiple-value sensors, and rapid cool-down jets. Additional programmability can also be enhanced by TEGAL ETch Tool (TES) software. Furthermore, TEGAL 903E's user friendly design allows for easy operation, maintenance and calibration.The asset features a dedicated graphical user interface, which includes step-by-step menu and real-time viewing & setting modes. The GUI also provides feedback on the etching process and allows for quick diagnostics in the event of a malfunction. TEGAL 903 E is designed for enhanced efficiency, repeatability, and accuracy ensured by its innovative suite of integrated technologies. It is an ideal tool for advanced packaging application, such as wafer bonding, microwave circuit packaging, nanofabrication, 3-D integration and MEMs fabrication.