Used TEGAL Plasmaline #89914 for sale

TEGAL Plasmaline is an etch and ashers used in dry etching of dielectric and metal layers. It uses a high-pressure and high temperature argon-chlorine gas mixture to etch and asher features on a work piece's surface. This process can be used for both shallow and deep etching. Additionally, the asher process can also be used to provide control over local topography. Plasmaline etcher/asher has two chambers that are used for dry etching. The first chamber is a showerhead plenum, which injects a high-pressure ArCl gas into the reaction chamber through the showerhead, creating a uniform distribution of the gas. The pressure and temperature of the reaction chamber is determined by the pressure and power of the ArCl gas mixture. The etching process is then carried out in the reaction chamber. The second chamber is the stabilization chamber which controls the pressure rise during the etching process and provides additional control over the process. TEGAL Plasmaline is a fully automated system that can control pressure, temperature, and gas flow. This helps to ensure a consistent etching result and repeatability. The control of the system is done using a programmable logic controller (PLC) that is integrated with the etcher. This allows for easy parameter changes depending on the needs of the project. Plasmaline is suited for both shallow and deep etch applications. The etching process is anisotropic which means it etches faster in some directions than others. Typically, the etch rate is faster on the corner radiused edges of a feature than on the flat surfaces. This allows for sharp features and tight tolerances to be achieved. TEGAL Plasmaline is also suited for local topography control. The asher process can be used to remove material uniformly from the surface of a device allowing for local topography changes. This is useful for planarization and other applications where the local topography needs to be controlled. Overall, Plasmaline is a reliable and robust etcher/asher that can provide consistent and repeatable results in a variety of etching and local topography control applications. The control that it provides over parameters such as pressure, temperature, and reaction time ensures that optimum results are obtained every time.