Used TEL / TOKYO ELECTRON 308 SCCM #9266666 for sale
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ID: 9266666
Wafer Size: 12"
Plasma etcher, 12"
TEL / TOKYO ELECTRON Telius DT Mainframe
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(4) KOMATSU FRV-6000-6 Chiller controllers
(2) TEL SCCM DT.
TEL / TOKYO ELECTRON 308 SCCM is a model of etcher / asher, which is designed to etch or asher films from semiconductor surfaces. This machine uses an all-in-one process of vacuum deposition, plasma etching, and chemical cleaning. It is capable of processing up to 30 individual wafers and offers superior wafer-to-wafer uniformity with negligible oxide residue. TEL 308 SCCM etcher / asher features a high-speed process chamber and automated control capability, allowing for high throughput and repeatable process control. This machine utilizes highly reliable robust gas coupling delivery connections and high-performance plasma valves to provide reliable and repeatable processes. Its Auto Test and Teach Mode allows the operator to establish a desired process from a standard recipe and/or visual confirmation of the process. The process can be controlled using several independent variables, including the RF power output, pressure, flow rates, and plasma composition. The machine is equipped with a 10 kW RF generator with power tuning capabilities for etching and ashing. This generator is designed to provide maximum process enablement and stability, even under harsh operation conditions and fluctuating gas supply. TOKYO ELECTRON 308 SCCM etcher / asher is further configured with dual excitation plasma sources providing uniform plasma density and extending the range of available etching processes. This feature also reduces the risk of plasma instabilities that can limit process yield and quality. Its high-end safety features help protect the operator from potential hazards. In summary, 308 SCCM is an etcher / asher designed for use in semiconductor manufacturing. It offers a range of features including a 10 kW RF generator with tuning capabilities, dual excitation plasma sources, automated process control, and a robust gas coupling delivery connections. This machine is highly reliable and delivers high throughput rates, consistent wafer-to-wafer uniformity, and superior process results.
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