Used TEL / TOKYO ELECTRON Chamber for SCCM #293821279 for sale

TEL / TOKYO ELECTRON Chamber for SCCM (a.k.a. etcher / asher) is a multi-functional etching and ashing equipment developed by TEL. It is designed to provide precise, precise and uniform etching of various substrates. It is specifically designed to meet the strict requirements of substrate preparation and high-end lithographic processing. TEL Chamber for SCCM features an integrated, high-precision etching chamber module which consists of a durable aluminum body and a quartz enclosure. There are six side and top-facing sources of heat, which can be independently controlled and have a maximum temperature of up to 1,000°C. This ensures uniform and efficient heating and cooling of the substrate. The etching chamber has two gas inlets, with argon, chlorine, oxygen, and nitrogen at their disposal, allowing for the etching of various substrates. The system also has an advanced timing unit which allows for the etching cycle to be accurately timed, ensuring the perfect etch for the desired material. The machine can carry out both single-wafer and batch-style etches and has an automatic calibration tool which continuously adjusts the parameters of the entire etching process. The automated gas purge asset allows for the etching chamber to remain safe and clean during operation. The model also has an efficient, multi-stage filtration equipment, which ensures a clean etching environment. It also has a high-precision light intensity control system which can be programmed to match the light environment of each application. Thicker substrates can be etched using the high intensity wash and dry unit. In addition, different process procedures, such as chemical etching, can be done with the SCCM, allowing for efficient and precise control of the etching process. The machine can also be used for other activities such as bond-prep and back-side clean up. Overall, TOKYO ELECTRON Chamber for SCCM is an advanced etching and ashing tool which can efficiently and precisely etch different substrates. Its integrated etching chamber, coupled with its advanced timing asset and gas purge model, provides an optimal process to ensure the perfect etch for any substrate. Moreover, its light intensity control equipment, filtration system and automated gas purge unit, contribute to reduce contamination and to ensure a safe etching environment.