Used TEL / TOKYO ELECTRON Chemical Vapor Deposition (CVD) systems #293665947 for sale

TEL Chemical Vapor Deposition (CVD) Systems are etching/ashing systems used to deposit thin films of material on surfaces in a controlled manner. The system combines the physical and chemical principles of vapor deposition with high-temperature chamber processes for a variety of applications. It is capable of precise deposition of thin-film coatings onto substrate materials such as glass, metals, and semiconductor grade materials. At its core, CVD is a vapor-phase process which involves the introduction of a reactant gas (or gases) into a chamber where a substrate and a heated surface are held at high temperatures. The reaction of the reactant gas with the heated surface produces a film of the desired material on the substrate. This film is usually very thin, often possessing dense and uniform characteristics. Common applications of CVD include depositing dielectric and conducting films for semiconductor chips, thin-film optical layers for solar cells, display devices, and protective coatings for medical and automotive components. In addition, the technology is also used for depositing metal and ceramics for corrosion, wear, and thermal barrier protection. During operation, the system consists of a high vacuum chamber, gas supply lines, a kinematic vacuum pump, and a reaction vessel. Before beginning, the vacuum chamber needs to be evacuated to a pressure of 1 x 10-4 mbar. After vacuum is attained, the gaseous reactant is injected in the reaction vessel, where a heated surface is present. The gas will undergo a rapid exothermic reaction with the heated surface, producing a vapor and creating a film on the substrate material. At the same time, the reactant should enter the reaction vessel at a predetermined temperature and in precise amounts. Depending on the condition of the reactant gas, the temperature and duration of the deposition process should be carefully controlled. This ensures that the desired film is deposited on the substrate material efficiently and uniformly. When the process is finished, the reactant gas is turned off and the reaction vessel depressurized. The resulting thin film is removed from the substrate, collected, and processed further according to its purpose. In summary, TOKYO ELECTRON Chemical Vapor Deposition Systems provide a precise, reliable method of depositing thin films of materials onto substrates. The process is adjustable to the exact specifications of the desired material and thin film. By properly controlling the temperature and duration of the process, uniform and highly dense thin films can be produced. This technology is widely used in the electronics, aerospace, automotive, and medical industries, among others, due to its efficiency and effectiveness in depositing films.