Used TEL / TOKYO ELECTRON Formula-1-H #293641260 for sale
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ID: 293641260
Wafer Size: 12"
Vintage: 2002
Diffusion furnace, 12"
Missing parts:
VV1 Valve
VV2 Valve
(2) 3887-202745-12 FFU Cylinders
015-017731-1 SIH2CL2 MFC
Waves monitor
VEC Controller
2002 vintage.
TEL / TOKYO ELECTRON Formula-1-H (F1-H) is a high performance etcher/asher that is used to rapidly process semiconductor wafers. It is capable of etching and ashing wafers at temperatures up to 600°C and has a dual, gas supply equipment to support etching of all three major semiconductor materials. The F1-H is also equipped with a high-resolution table-top image/filter and digital image processing systems, as well as advanced process control systems. The F1-H has an improved design featuring a robust aluminum-based vacuum chamber and is capable of performing etching and ashing with the same process and chamber. This allows for the manufacturing of tight line widths and tolerance levels for the production of complex VLSI circuits. Additionally, process control is easy to setup and maintain with the F1-H's dedicated console terminal. The F1-H is also equipped with an advanced chamber cooling system, which keeps the chamber temperatures stable during processing and eliminates thermal stress on the work pieces. Furthermore, the unit's gas delivery unit enables precise gas control of up to six independent gas channels, allowing for precise control of etching and ashing parameters. The F1-H also features a wafer cleaning machine that can be configured to use gentle cleaning methods to reduce the potential of damaging delicate wafers. The F1-H has a process time of only 30 minutes, which coupled with its excellent etching and ashing capabilities, allows for high throughput and manufacturing efficiency. Additionally, the unit's programmable controller allows users to store and recall process recipes, and is compatible with several SEMI standard software programs. All in all, the F1-H is a reliable, high performance etcher/asher that is suitable for high-volume production of multi-layer semiconductor components.
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