Used TEL / TOKYO ELECTRON Formula #9121065 for sale

TEL / TOKYO ELECTRON Formula (TEF) is an advanced etcher / asher platform for semiconductor fabrication processes, providing superior precision and control of material removal process. TEF technology consists of a high-precision platen, a vacuum chamber, and a gas delivery system. The top plate is made of 304L stainless steel for superior abrasion and corrosion resistance. The high-precision suction cup underneath the plate allows for accurate positioning of the wafer, even when large loads are applied. The vacuum chamber has a unique configuration that allows for higher process control over etch rates and uniformity. The gas flow is regulated within a closed-loop feedback system. All the necessary process parameters can be adjusted to achieve the desired process results. The TEF etcher / asher platform features a number of performance advantages, such as high etch rate and process yield, process repeatability, and uniform etching. The high-precision suction cup, with a diameter of 30 or 50 mm, is designed to provide accurate positioning of the wafer during the etching process. This ensures uniform and repeatable results. The vacuum chamber also features a uniform gas pressure and flow rate to ensure uniform etching. Additionally, the ability to adjust parameters easily allows for better control of the etch rate, which can eventually lead to higher process yield. The TEF platform is equipped with dual-track technology, which provides a wide range of process solutions such as conventional etching and directional etching, as well as metal-semiconductor etching. This feature is designed to be compatible with a number of etch gases and enables users to optimize their processes by using the most efficient etchant for their application. The TEF platform also incorporates a three-dimensional profile monitor (TPM), which helps monitor and adjust the etching process in real time for improved process performance. Overall, TEL Formula platform is an advanced etcher/asher designed specifically to maximize semiconductor fabrication process efficiency and yield. Its high-precision suction cup, uniform gas pressure and flow rate, dual-track technology, and TPM enable users to take full control of the etching process for superior process performance.