Used TEL / TOKYO ELECTRON Formula #9250263 for sale

TEL / TOKYO ELECTRON Formula (TEL/TEF) is an advanced etcher / asher used in the fabrication of integrated circuits. This specialized equipment is used to etch patterns onto a wafer as part of the multiple layers of photolithography process and has become essential in advanced semiconductor device manufacturing. TEL Formula has a modular design, which allows it to perform a wide range of etching steps. This includes manual and automated substrate handling, wafer-level plasma etch, sub-micron patterning resolution, and wafer-level photo-coating. The advanced etch process, which increases throughput and precision, can create intricate patterns with very low levels of variation. TOKYO ELECTRON Formula uses plasma etching technology to create patterns on the wafer surface. During the etch process, an advanced plasma source with variable pressure and temperature generates a plasma environment where etching gases create an active species in the chamber to form a plasma. The plasma environment is then used in combination with specific etching gases to remove material from the wafer to form the desired pattern. Formula is also capable of electron beam lithography and maskless photolithography. Electron beam lithography utilizes an electron beam to precisely draw patterns onto a wafer surface. Maskless photolithography uses an advanced laser to quickly etch patterns with a precision much greater than traditional lithography techniques. TEL / TOKYO ELECTRON Formula offers tremendous accuracy and repeatability that can easily be achieved with its advanced etching capabilities. Additionally, due to its modular design, TEL Formula can be easily adapted and upgraded to meet the evolving needs of modern semiconductor device manufacturers. Overall, TOKYO ELECTRON Formula is an advanced etcher / asher used in the fabrication of integrated circuits. It uses a combination of plasma etching, electron beam lithography, and maskless photolithography to etch very precise patterns on a wafer surface. Its modular design allows for flexibility and upgradability to make it the go-to etching solution for semiconductor manufacturers.