Used TEL / TOKYO ELECTRON Formula #9300653 for sale

ID: 9300653
Wafer Size: 12"
Furnace, 12" Process: ALD High-K.
TEL / TOKYO ELECTRON Formula is an etcher / asher machine designed for substrate processing. This machine uses reactive ion etching (RIE) and chemical vapor etching (CVD) processes to perform etching and other substrate processes. TEL Formula etcher / asher combines two types of etching technology to achieve maximum results. The first type is RIE, which uses an inductively coupled plasma (ICP) to etch substrates. ICP is an efficient etching technology, and can be tailored to the specific pattern desired. RIE technology is used to create patterns such as trenches and columns. The second type is the chemical vapor etching (CVD), which is a dry etching process. This process is also highly efficient and can be tailored to create precise etching patterns. CVD etching is commonly used for thinning layers and creating through-substrate vias (TSV) for highly integrated circuits. TOKYO ELECTRON Formula etcher / asher is designed to precisely control the etching process. It uses a range of parameters to control etching processes such as pressure, temperature, time, and power. This allows for precise etching and better process repeatability. For materials compatibility, Formula etcher / asher can work with a variety of substrates such as silicon, quartz, and other materials. It can also work with a range of precursors such as chlorides, fluorides, and alkanes. In addition, TEL / TOKYO ELECTRON Formula etcher / asher offers a high level of automation. This automation allows processes to be performed unattended and with minimal intervention. Automations processes such as remote control and process planning reduce processing time by up to 50%. Overall, TEL Formula etcher / asher is a reliable and precise system for performing etching and other substrate processing tasks. It offers a range of etching technologies, a high level of automation, and compatibility with a variety of substrates and precursors. This makes it a popular choice for etching and other substrate processes.
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