Used TEL / TOKYO ELECTRON Formula #9384119 for sale

TEL / TOKYO ELECTRON Formula is an advanced etching (or ashing) equipment designed for semiconductor manufacturing applications. This system is capable of carrying out highly complex etching processes with high accuracy and repeatability. TEL Formula comes with a variety of different tools such as the Plasma Source, The Clean Etch Vacuum Chamber, a Plasma Generator, and the End Point Silicon Memory Cell Processor. Together, these components are designed to enable the user to carry out processes such as chemical-mechanical planarization (CMP), plasma etching, and dry etching. It also comes with the capability to monitor, measure, and control the etching process. The Plasma Source in TOKYO ELECTRON Formula is capable of producing highly uniform and repeatable plasma with a high degree of ionization. This produces a consistent etching pattern that can be directed precisely along intended paths. The Clean Etch Vacuum Chamber enables the user to set specific etching voltages and gas flow rates to ensure uniform etching. The Plasma Generator provides a powerful source of energy for precise and repeatable etching. Finally, the End Point Silicon Memory Cell Processor builds upon the Plasma Generator's capabilities by allowing users to store and use up to 40 different etching recipes with a single button selection. The sophisticated controls used in Formula enable advanced process characterization and monitoring. These include DC and RF Etch Rate, DC:RF ratio, etching depth control, post etch surface quality, line density, overlay, and defectivity. This unit also allows for height profiling and offers real-time visualization of the etching process through the Meso-Cam machine. This feature enables the user to hone in on areas of the wafer for more accurate etching and to observe etch characteristics without having to pull the wafer. The advanced features of TEL / TOKYO ELECTRON Formula help ensure the quality and accuracy of etching processes. This tool provides a complete etching package with the flexibility to perform sophisticated processes such as dry etching, ion milling, oxide liftoff, deep silicon etching, and high aspect ratio etching. It can also be used for post-etching cleaning of wafers using either reactive ion etching (RIE) or carbon-assist dry etching (CADe), improving process control and yield improvement. When used in conjunction with other TEL products, TEL Formula provides a powerful and cost-effective solution for improved process control and yield optimization. The asset is designed for easy integration into in-line processes and can be configured to meet specific production needs. This tool helps manufacturers control processes to a higher degree of accuracy, thus ensuring higher levels of product quality and reliability.