Used TEL / TOKYO ELECTRON Formula #9384151 for sale

TEL / TOKYO ELECTRON Formula (TEF) is an etcher / asher designed for high throughput and highly reliable wafer etching. It features advanced lithography, thin film deposition capabilities, and a high precision reactive ion etch (RIE) module. The TEF platform utilizes state-of-the-art plasma-process control technologies to ensure optimal etch uniformity, repeatability, and process coverage. It is capable of achieving excellent etch profile, across a wide range of substrate materials. The TEF equipment is based on a frame-like structure consisting of a RF generator, etch chamber, and wafer transfer chamber. The RF generator is used to create the plasma needed to etch the wafer. The etch chamber is a semiconductor-grade quartz chamber that is highly resistant to thermal and mechanical stresses, allowing the system to operate for longet periods of times with minimal maintenance and downtime. The wafer transfer chamber is designed to minimize the time between wafers, allowing for continuous etching operations. The TEF unit utilizes multiple technologies to achieve high etch precision and uniformity. Advanced lithography and deposition processes are used to create feature-specific patterns on the wafer surface and form a stable etch profile throughout the etching process. The machine is also capable of performing atomic layer etching (ALE) for ultra-thin lithography patterns. The tool is equipped with process control technologies such as real-time etch rate measurements, endpoint sensing, and process diagnostic capabilities. These technologies are used to monitor the progress of the etch process and ensure that the etched features are of the highest quality. The TEF asset is also designed with temperature and pressure control capabilities to provide uniform etching throughout the chamber. Finally, the TEF model is designed for integration with process automation systems. The equipment is equipped with wafer handlings capabilities that enable integration with other process tools in the production line and provide a seamless transition of wafers from one machine to another. This allows for increased throughput without compromising accuracy or quality.