Used TEL / TOKYO ELECTRON Indy-B-L #293637436 for sale
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ID: 293637436
Wafer Size: 12"
Vintage: 2009
LPCVD Furnace, 12"
Wafer type: Si semi STD Notch
(100) Production wafers
Maximum operating temperature: 500-1000
N2 Load lock
Boat type handling position
O2 Density control for N2 Load lock
N2 Boat shower wafer cooling
560A Furnace temperature controller
VMM-56-002 Heater
Wafer / Carrier handling:
(25) Carrier type: FOUP
ENTEGRIS A300
Carrier stage capacity: 16
Pin pad A, B
Fork material: Al203 and peek
W/T Type: 1+4 Edge grip
W/T Auto teaching
Furnace facilities:
Furnace exhaust connection point: Top connection
Cooling water connection point: Bottom connection
Gas specification:
IGS 1.5" W-seal rail-mount
FUJIKIN IGS
Tubing bend bend (Less than 90°)
HORIBA STEC
Incoming gas connection point: Bottom connection
Gas vent connection point: Bottom connection
Gas unit exhaust connection point: Bottom connection
Process gas exhaust connection point: Bottom connection
Exhaust specification:
MKS Vacuum gauge-press controller
MKS Vacuum gauge-press monitor
MKS Vacuum gauge-pump monitor
CKD-VEC Main valve
Condenser
Reactor specification:
Tube material: Quartz (outter), quartz (inner)
Inner tube Type (LP): Straight
Inner T/C: Outer tube inferior (wall type)
Tube sealing: O Ring
Soft backfill injector
Boat type: (117) Slots, pitch, 8 mm
Boat rotation
Pedestal type: Quartz
No shutter purge type
Interface specification:
Host communication: Comply with GJG
Equipment host I/F connection: Gas box top HSMS
Ingenio
OHT Capability
Load port operation: Upper
PIO I/F Location: FNC Top
HOKUYO DMS-HB1-Z PIO
RF Carrier ID reader writer type
CIDRW L/P: Read and write
ASYST ATR 9100 CIDRW
TEL CIDRW
User interface
Signal tower model: Customized
Signal tower colors (From the Top): Red / Green / Yellow
Signal tower location: Front
Front operation panel
MMI and gas flow chart: Gas box and front operation panel installed
Indicator type: Superset
Operator switch: Operator access / orange
Pressure display unit (gas inlet / vacuum): Mpa / Pa
Cabinet exhaust pressure display unit: Pa
Gas leak detector:
Gas1 / SiH4
Gas2 / PH3
Gas3 / ClF3
Cable length:
FNC-Power box: 20 meter
Power box -refill system: 30 meter
Power specification:
Voltage: 208 VAC, 3 Phase
Phase connection type: Star connection
Voltage single-phase: 120 VAC
Single-phase connection type: Grounded
Frequency: 60 Hz
Power cable input entrance location: Power box top
2009 vintage.
TEL / TOKYO ELECTRON Indy-B-L is an indoor wafer etcher/asher creating thin oxide films on semiconductor wafers. It is a high performance, medium-throughput, single-chamber dry etching equipment. The system is fully automated with an operator's interface providing users with a user-friendly process control and optimization. TEL INDY B L unit is capable of performing both etching and ashing processes for a large variety of applications such as CoO, AlOx, ITO, and others. Inside TOKYO ELECTRON INDY B-L there is a 5 layer Quartz chamber, adjustable pressure pipes, and 4 independently controlled jet N2 purge outlets. The pressure is monitored and controlled by the components inside the control rack; a sensor sends readings both outside and inside the chamber. The N2 purge outlets and parameter setup in the etcher/asher enable precise and complete exhaust of the reaction gas for residue free wafers. TEL Indy-B-L has a chamber maximum size ranging from 200 mm to 8 inches with the highest temperature processing of up to 400°C. High-density, ECR plasma is generated by the magnecreons which can be individually adjusted in order to achieve high quality results with a low load level and excellent matching characteristics across the rotation axis. The ECR source plasma offers improved uniformity in active layer etching at higher etching rate and better selectivity than traditional arc sources. INDY B-L is also equipped with an absorbent filter that automatically changes color in order to indicate the degree of contamination. This feature is useful for maintaining a consistent quality in both batch and single wafer processes. The absorbent will absorb and collect dust particles from the etching or ashing process, preventing it from entering the machine and contaminating the wafers. The programmable wafer-handling robot and transfer arm included with TEL / TOKYO ELECTRON INDY B L allows for batch and single wafer processing. It also provides an easy, safe wafer handling for a single operator. Additionally, there is a wafer detecting laser tool that makes sure the robot stays calibrated and reaches the optimal position when transferring and etching the wafers. TEL INDY B-L with its ECR plasma source and precise oven setting provides repeatable etching/ wiring with low uniformity errors, excellent process control and a low maintenance cost. It is a highly reliable asset with simple and intuitive user interface controls and alert functions, ideal for batch and single wafer processing applications.
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