Used TEL / TOKYO ELECTRON Indy-B-L #293637436 for sale

ID: 293637436
Wafer Size: 12"
Vintage: 2009
LPCVD Furnace, 12" Wafer type: Si semi STD Notch (100) Production wafers Maximum operating temperature: 500-1000 N2 Load lock Boat type handling position O2 Density control for N2 Load lock N2 Boat shower wafer cooling 560A Furnace temperature controller VMM-56-002 Heater Wafer / Carrier handling: (25) Carrier type: FOUP ENTEGRIS A300 Carrier stage capacity: 16 Pin pad A, B Fork material: Al203 and peek W/T Type: 1+4 Edge grip W/T Auto teaching Furnace facilities: Furnace exhaust connection point: Top connection Cooling water connection point: Bottom connection Gas specification: IGS 1.5" W-seal rail-mount FUJIKIN IGS Tubing bend bend (Less than 90°) HORIBA STEC Incoming gas connection point: Bottom connection Gas vent connection point: Bottom connection Gas unit exhaust connection point: Bottom connection Process gas exhaust connection point: Bottom connection Exhaust specification: MKS Vacuum gauge-press controller MKS Vacuum gauge-press monitor MKS Vacuum gauge-pump monitor CKD-VEC Main valve Condenser Reactor specification: Tube material: Quartz (outter), quartz (inner) Inner tube Type (LP): Straight Inner T/C: Outer tube inferior (wall type) Tube sealing: O Ring Soft backfill injector Boat type: (117) Slots, pitch, 8 mm Boat rotation Pedestal type: Quartz No shutter purge type Interface specification: Host communication: Comply with GJG Equipment host I/F connection: Gas box top HSMS Ingenio OHT Capability Load port operation: Upper PIO I/F Location: FNC Top HOKUYO DMS-HB1-Z PIO RF Carrier ID reader writer type CIDRW L/P: Read and write ASYST ATR 9100 CIDRW TEL CIDRW User interface Signal tower model: Customized Signal tower colors (From the Top): Red / Green / Yellow Signal tower location: Front Front operation panel MMI and gas flow chart: Gas box and front operation panel installed Indicator type: Superset Operator switch: Operator access / orange Pressure display unit (gas inlet / vacuum): Mpa / Pa Cabinet exhaust pressure display unit: Pa Gas leak detector: Gas1 / SiH4 Gas2 / PH3 Gas3 / ClF3 Cable length: FNC-Power box: 20 meter Power box -refill system: 30 meter Power specification: Voltage: 208 VAC, 3 Phase Phase connection type: Star connection Voltage single-phase: 120 VAC Single-phase connection type: Grounded Frequency: 60 Hz Power cable input entrance location: Power box top 2009 vintage.
TEL / TOKYO ELECTRON Indy-B-L is an indoor wafer etcher/asher creating thin oxide films on semiconductor wafers. It is a high performance, medium-throughput, single-chamber dry etching equipment. The system is fully automated with an operator's interface providing users with a user-friendly process control and optimization. TEL INDY B L unit is capable of performing both etching and ashing processes for a large variety of applications such as CoO, AlOx, ITO, and others. Inside TOKYO ELECTRON INDY B-L there is a 5 layer Quartz chamber, adjustable pressure pipes, and 4 independently controlled jet N2 purge outlets. The pressure is monitored and controlled by the components inside the control rack; a sensor sends readings both outside and inside the chamber. The N2 purge outlets and parameter setup in the etcher/asher enable precise and complete exhaust of the reaction gas for residue free wafers. TEL Indy-B-L has a chamber maximum size ranging from 200 mm to 8 inches with the highest temperature processing of up to 400°C. High-density, ECR plasma is generated by the magnecreons which can be individually adjusted in order to achieve high quality results with a low load level and excellent matching characteristics across the rotation axis. The ECR source plasma offers improved uniformity in active layer etching at higher etching rate and better selectivity than traditional arc sources. INDY B-L is also equipped with an absorbent filter that automatically changes color in order to indicate the degree of contamination. This feature is useful for maintaining a consistent quality in both batch and single wafer processes. The absorbent will absorb and collect dust particles from the etching or ashing process, preventing it from entering the machine and contaminating the wafers. The programmable wafer-handling robot and transfer arm included with TEL / TOKYO ELECTRON INDY B L allows for batch and single wafer processing. It also provides an easy, safe wafer handling for a single operator. Additionally, there is a wafer detecting laser tool that makes sure the robot stays calibrated and reaches the optimal position when transferring and etching the wafers. TEL INDY B-L with its ECR plasma source and precise oven setting provides repeatable etching/ wiring with low uniformity errors, excellent process control and a low maintenance cost. It is a highly reliable asset with simple and intuitive user interface controls and alert functions, ideal for batch and single wafer processing applications.
There are no reviews yet