Used TEL / TOKYO ELECTRON Indy-B-L #9394957 for sale

TEL / TOKYO ELECTRON Indy-B-L is an etching and ashing equipment built with advanced technology for accurate and efficient patterning of wafer substrates. This system has been designed to maximize the capabilities of etching and ashing processes, particularly in semiconductor manufacturing. Using dedicated systems for each of the etching and ashing processes, TEL INDY B L enables the precise optimization of etching parameters, such as gassing pressures and chamber temperatures, while optimizing the removal of targets from substrates. This results in improved substrate yield and circuit reliability. The unit features a gas box which operates within an optimum pressure range for each of the operating gases, helping to secure uniform gas distribution for improved etch selectivity. TOKYO ELECTRON INDY B-L is also equipped with dedicated electrode power supplies which are designed for stable, uniform outputs for improved plasma uniformity. This assists in achieving precise control over etching by means of fine adjustment of gas pressure, allowing for accurate, uniform results. Furthermore, a load-lock mechanism prevents the mixing of etching and ashing gases while allowing for simple and convenient wafer loading. TEL / TOKYO ELECTRON INDY B-L also benefits from a built-in advanced control machine that has been designed for precise temperature control and gas distribution during each process. This helps to maximize the throughput of wafers, while also enabling uniform endpoint control for improved results. A coated chamber interior also helps to prevent contamination during etching, thereby securing potential device yields. In addition, a resist stripping capability has been incorporated within TOKYO ELECTRON INDY B L tool, allowing for the efficient removal of unwanted carbon residues from substrates. This results in improved product yields and functionality, while also reducing the use of hazardous chemicals. To conclude, TEL Indy-B-L asset provides sophisticated etching and ashing capabilities which are designed to meet the demands of the modern, high-precision wafer industry. This model offers a range of features which enhance the capabilities of both etching and ashing processes, resulting in improved yields and circuit reliability.