Used TEL / TOKYO ELECTRON INDY PLUS B M #293637541 for sale

TEL / TOKYO ELECTRON INDY PLUS B M
ID: 293637541
Wafer Size: 12"
Vintage: 2010
Furnace, 12" 2010 vintage.
TEL / TOKYO ELECTRON INDY PLUS B M etching equipment is designed for wafer level volume production and can be integrated into a variety of wet benches, loadports and clean stations. Featuring advanced inductively coupled plasma (ICP) and a rapid thermal cycling (RTC) module, this system provides outstanding performance in silicon etching processes. The unit is equipped with a station control machine intermediate controller (SCIC) that simplifies tool operation and maintenance. An easy-to-use graphical user interface guided through the asset ports when necessary, and can ascertain point-to-point data acquisition and model status. The SCIC is complemented by a recipe storage feature which allows for the storage of multiple recipes and can be used with multiple systems and tool configurations. TEL INDY PLUS B-M etching equipment features an ICP generator and a Rapid Thermal Cyclic (RTC) module to provide stable and uniform processes. ICP is a high-frequency (13.56 MHz) capacitively coupled plasma source. The ICP helps to improve etch uniformity, increase the etch rate and ensure a high level of selectivity throughout the etching process. The ICP generator also enables process applications to be quickly and precisely tuned to achieve the desired etch results. The RTC module can cycle between hot and cold within milliseconds in order to perform rapid thermal annealing (RTA), which helps improve process uniformity and maintain short etch times. TOKYO ELECTRON INDY PLUS-B-M etching system is designed to support temperature and wafer-level control. The process substrate temperature is spedily monitored and highly regulated to vary gas flow parameters and power levels in order to optimize the etch rate and uniformity. Wafer transfer and handling is also taken care of by its auto-alignment and OCR features, ensuring that each substrate enters the process chamber with its trailing edge perpendicular to the surface of the wafer. This unit utilizes multiple pumps, turbo-molecular pumps and chemical injection systems to manage the process chamber. The built-in mass flow controllers (MFCs) manage processes to maintain a controlled atmosphere within the chamber. Furthermore, it is designed with a number of safety features such as ion beam safety shutters, RF basket safety shutters, and real-time chamber pressure monitoring. In conclusion, TEL / TOKYO ELECTRON INDY PLUS B-M etching machine is a reliable and robust etching tool for the production of high quality, precision wafers. Its combination of ICP, RTC, and wafer level control ensures a process uniformity and yields with stable repeatability results. Its intuitive heat resistance function reduces maintenance costs and supports working in a variety of process chambers.
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