Used TEL / TOKYO ELECTRON MB2-730HT #9145481 for sale

TEL / TOKYO ELECTRON MB2-730HT
ID: 9145481
Wafer Size: 8"
Vintage: 1996
CVD System, 8" (3) Chambers WSi Process 1996 vintage.
TEL / TOKYO ELECTRON MB2-730HT is a highly efficient and reliable etcher/asher. It is a CMOS/BiCMOS Etcher, Asher and Stress Relief System capable of performing high quality processing in the harsh conditions of advanced materials. This system is designed for use in advanced semiconductor fabrication, using plasma-based etching and deposition techniques to produce quality parts and components. The system combines high-speed performance with precision and flexibility, enabling high yields on complex products. This etcher/asher features an advanced plasma generated power supply that is laser-monitored for process control, providing a uniform environment for etching and ashing. This unit features an easy to use touch-screen interface for intuitive operation. This unit is also suitable for batch processing, utilizing tungsten insulated chamber technology for precise temperature control to ensure successful etch/ash processes. TEL MB2-730HT also features a triple-gas source, allowing for process variations such as deep reactive etching, blanket deposition, and through-mask removal. Its advanced waffle-plate design reduces etch time and substrate damage during process. It is also equipped with an on-board film thickness monitor and detectors, allowing for precise process control with a minimum of user intervention. TOKYO ELECTRON MB2-730HT is a reliable, versatile and efficient etcher/asher capable of producing quality parts while maintaining low operating costs and minimal damage to substrates. It is designed to be compatible with a multitude of process chemistries and substrates, allowing for maximum process flexibility when creating a wide variety of complex products. This unit is rated for semi-automated operation, allowing for repeatable production with little user intervention. MB2-730HT can be used in a variety of semiconductor fabrication applications, ranging from high performance logic and memory modules to optical components and advanced packaging.
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