Used TEL / TOKYO ELECTRON SCCM Shin #9409054 for sale

TEL / TOKYO ELECTRON SCCM Shin
ID: 9409054
Vintage: 2006
Etcher 2006 vintage.
TEL / TOKYO ELECTRON SCCM Shin is a powerful and cost-effective multi-chamber etcher / asher used for semiconductor device production. This piece of equipment helps in etching away unwanted materials during the device fabrication process. The machine is capable of operating at temperatures up to 1,100°C and pressures up to 1.2MPa, making it ideal for a variety of process applications. TEL SCCM Shin is also equipped with an advanced multi-chamber design, enabling it to serve multiple etching or etching/shelling combinations without having to swap out parts. This flexibility allows for higher throughput and better utilization of the machine. Users have the ability to program TOKYO ELECTRON SCCM Shin for a variety of etching and etching/shelling process applications, including selectivity control and uniformity enhancement of etched materials. The use of the machine's multi-chamber system also allows for gas delivery and gas distribution control throughout multiple etch chambers. Such precise gas delivery ensures optimal process performance, enabling higher yields and device quality. SCCM Shin has built in process automation control, allowing staff to run the machine with minimal oversight. A user-friendly Graphical User Interface (GUI) makes set-up and monitoring of the machine easy and straightforward, while several safety measures are in place to reduce the risk of errors that can result in poor device quality. For optimal results, the machine is designed to maintain precise temperature, pressure and timing control throughout the etching process. Overall, TEL / TOKYO ELECTRON SCCM Shin is a reliable and cost-effective etcher/asher, capable of producing high-quality devices for various electronic applications. The precision control and automated process provide accurate results with minimal user oversight, making TEL SCCM Shin an excellent choice for any semiconductor production line.
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