Used TEL / TOKYO ELECTRON TE 480 HGC #293592867 for sale

TEL / TOKYO ELECTRON TE 480 HGC is an ultra-high-precision and highly reliable etcher/asher, with many useful features. It is a medium-precision equipment with a medium load capacity. The system consists of a load-lock chamber, plasma source, substrate heating element, etching chamber, backside cooling unit and exhaust unit. The load-lock chamber is equipped with a load port and gate valves for in/out loading of substrates. The plasma source is an inductively-coupled radio-frequency (RF) source for generating a high-density plasma in the etching chamber. The substrate heating element can be used to precisely control the temperature of the substrate in the etching chamber. The etching chamber is designed to sustain process temperatures of up to 500°C, so it is suitable for a wide range of etch processes. The etching chamber is equipped with a perforated top and bottom plate, so that the process gases can be uniformly distributed in the chamber. The chamber also has an integrated cooling unit to ensure uniform temperature across the substrate. The backside cooling unit is used for cooling the substrate during etch processes. The cooling effect of the unit is adjustable depending on the substrate size, etch process, and process conditions. The exhaust unit is designed to keep the process chamber clean while preventing the escape of process gases to the environment. In addition to the above features, TEL TE 480 HGC is equipped with two interfaces; Industry 4.0 and Extended Service Control (ESC). The Industry 4.0 interface provides secure communication between the unit and the operator and helps ensure that the etching process is operating correctly. The Extended Service Control (ESC) module allows remote maintenance, machine diagnostics and upgrade features. Overall, TOKYO ELECTRON TE 480 HGC is an excellent choice for medium-precision etching and ashing applications. The high accuracy and reliability of the tool, combined with advanced and easy-to-use control interfaces, make it an ideal selection for a wide range of semiconductor-related applications.