Used TEL / TOKYO ELECTRON TE 5000 #9181766 for sale

TEL / TOKYO ELECTRON TE 5000 is an etcher/asher designed to effectively etch and ash wafers, integrated circuits, and other components with precision and repeatability. This machine utilizes an advanced optical spectrophotometer to precisely measure the process parameters in real-time for superior etching and ashing. The ultra-high vacuum environment created by TEL TE5000 prevents particles in the air from affecting the etching/ashing process and provides an ultra-clean environment for reliable operation. Additionally, the asher provides improved selectivity to ensure minimal undesired etching of smaller features. TOKYO ELECTRON TE-5000 supports substrate sizes from 1 inch to 8 inch, with a maximum temperature of 850°C, a maximum chamber pressure of 0.5 torr, and an Asher bandwidth of 8 kHz. The equipment has a maximum step height of 20 µm, and also features a Programmable Coil Assembly which ensures uniform etching and an even reduction of oxide layers. Program embedding for various wafer processing details is also possible with TE 5000. TE-5000 features a variety of sub-systems to optimize the process including a Process Reactor Chamber, an In-Process Chamber Control Unit (ICCU), a Robust Heavy Duty SEM Column, a fast-operating Chemical Supply System, a High-Performance Microwave Generator, and a Real-time Gas Injection Unit. It also utilizes a specialized software package for fast data retrieval, interactive communication, process optimization, and friendly graphic interfaces. For improved safety and efficiency, TOKYO ELECTRON TE5000 includes a wafer cassette tilt machine, an In-Plane Service Bag Filter (IPF) for the collection of fine particulate, and an ultra-safe, noise-reducing enclosure with filters and cleaner tool. In addition, it is designed to save energy by utilizing a proprietary thermal magnetron technique (THANM) to decrease gas consumption and reduce the cost of operation. Overall, TE5000 is an advanced etcher/asher designed for precise etching and ashing of wafers, integrated circuits, and other components. With its advanced optical spectrophotometer and a wide range of cutting-edge features, this machine ensures reliable operations and improved processability.