Used TEL / TOKYO ELECTRON TE 580LC #9109090 for sale

TEL / TOKYO ELECTRON TE 580LC is an advanced etcher / asher process tool for ultra-fine patterning and smooth surface finish. This etcher / asher delivers high throughput with excellent particle contamination control, and provides superior uniformity across wafers. This advanced etcher / ascher features a loading and unloading cassette. This system can be loaded with up to 8 cassettes, allowing for more efficient wafer teleportation. The advanced TEL TE 580LC asher / etcher also features an improved stage design that reduces wafer backlash and potential damage to the wafer. Once the wafers are loaded, TOKYO ELECTRON TE 580LC etcher/asher utilizes a load lock process chamber. This process chamber is equipped with one or two sublimation furnaces and a substrate bias. This combination of technologies allows for improved process control, faster wafer turnaround, and improved edge definition. The etcher/asher also features advanced etch control capabilities. This advanced etch control allows the user to vary the etch rate via an automated magnetic field. This etch rate can be adjusted according to specific requirements. Furthermore, this advanced etcher/asher has a high capacitance energy storage system for improved etch uniformity and precise control. The improved etch uniformity allows for better process repeatability and higher yields. TE 580LC also features a high temperature process with a maximum temperature of 400°C. This feature helps to achieve superior profile performance and ensure high product quality. It also helps to prevent resist outgassing, which has been a common problem that reduces throughput. Additionally, this advanced etcher/asher includes advanced neutron radiation detection for contamination control. This feature helps to ensure that any unwanted contaminants are detected and quickly removed. Overall, TEL / TOKYO ELECTRON TE 580LC etcher/asher is a highly advanced process tool for ultra-fine patterning and smooth surface finish. It provides excellent throughput and superior uniformity across wafers, and is able to achieve superior profile performance and process repeatability.