Used TEL / TOKYO ELECTRON TE 7400 #9202962 for sale

TEL / TOKYO ELECTRON TE 7400 is an etcher/asher designed for the decapsulation of semiconductor devices, display parts and packages. It is an economical solution for handling packages of device sizes ranging from miniaturized components to larger scale components. Featuring low operating costs and a short cleaning cycles, it can be used for a variety of etching applications such as photoresist removal, panel etching, metal cleaning, and more. Industry-leading features of TOKYO ELECTRON TEL TE 7400 include: Process Step Capability: TEL / TOKYO ELECTRON TOKYO ELECTRON TE 7400 has the flexibility to process different substrate sizes and materials, including substrates made of wet oxide, metal, Cr, Ti, alumina, and metal-oxide. It can process through a variety of steps including a single etch. Process Control: Its process control equipment automatically maintains the required process parameters, ensuring an accurate, reliable etching process. Safety and Reliability: TE 7400 is designed with an effective safety structure, that minimizes the risk of operator injury and environmental accidents. The device also uses advanced features, such as an auto start up and shut-down, as well as a dual gas supply system to ensure safe and reliable operation. High Process Quality: Two advanced features ensures the best process quality: the Cyclic Speed Regulation (CSR) mode, which ensures a uniform etching rate in the presence of varying load, and the Interface Control Unit (ICS), which enables precise control of etch gap and corner rounding. Robust Design: The etcher/asher is constructed of robust materials to ensure a long-lasting service life even in harsh conditions. Furthermore, its control machine is designed to tolerate external interference and is engineered to mitigate failure due to vibration, temperature changes, and more. Overall, TOKYO ELECTRON TEL / TOKYO ELECTRON TE 7400 is a reliable and economical etcher/asher ideal for decapsulation of semiconductor devices, display parts, and packages. With industry-leading features, robust construction, and advanced process control, it offers a high performing etching solution for any semiconductor application.